Uhlemann; Andre

Patent Applications and Registrations

Patent applications and USPTO patent grants for Uhlemann; Andre.The latest application filed is for "external contact element for a power semiconductor module and power semiconductor module".

Company Profile

3.9.15

Uhlemann; Andre - Wickede DE
Uhlemann; Andre - Dortmund DE
Uhlemann; Andre - Dortmung DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
External Contact Element For A Power Semiconductor Module And Power Semiconductor Module App 20220278070 - Uhlemann; Andre ; et al.	2022-09-01
Circuit Board Having A Cooling Area Above And Below A Semiconductor Chip App 20220183147 - Reiter; Tomas Manuel ; et al.	2022-06-09
Circuit board, chip cooling housing, assembly and method for cooling a semiconductor chip Grant 11,266,012 - Reiter , et al. March 1, 2	2022-03-01
Snubber Circuit and Power Semiconductor Module with Snubber Circuit App 20210006062 - Schlueter; Michael ; et al.	2021-01-07
Circuit Board, Chip Cooling Housing, Assembly and Method for Cooling a Semiconductor Chip App 20200196441 - Reiter; Tomas Manuel ; et al.	2020-06-18
Power Semiconductor Module and Method for Producing a Power Semiconductor Module App 20200183056 - Nikitin; Ivan ; et al.	2020-06-11
Directly Cooled Substrates for Semiconductor Modules App 20170304922 - Uhlemann; Andre ; et al.	2017-10-26
Directly cooled substrates for semiconductor modules and corresponding manufacturing methods Grant 9,731,370 - Uhlemann , et al. August 15, 2	2017-08-15
Power semiconductor module with liquid cooling Grant 9,578,789 - Uhlemann , et al. February 21, 2	2017-02-21
Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip Grant 9,275,926 - Hable , et al. March 1, 2	2016-03-01
Cold Plate, Device Comprising a Cold Plate and Method for Fabricating a Cold Plate App 20160056088 - Uhlemann; Andre ; et al.	2016-02-25
Semiconductor device including cladded base plate Grant 8,963,321 - Lenniger , et al. February 24, 2	2015-02-24
Power Semiconductor Module with Liquid Cooling App 20140347818 - Uhlemann; Andre ; et al.	2014-11-27
Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip App 20140327127 - HABLE; Wolfram ; et al.	2014-11-06
Directly Cooled Substrates for Semiconductor Modules and Corresponding Manufacturing Methods App 20140321063 - Uhlemann; Andre ; et al.	2014-10-30
Power module with directly attached thermally conductive structures Grant 8,872,332 - Uhlemann , et al. October 28, 2	2014-10-28
Power Module with Directly Attached Thermally Conductive Structures App 20130285234 - Uhlemann; Andre ; et al.	2013-10-31
Semiconductor device including cladded base plate Grant 8,519,532 - Lenniger , et al. August 27, 2	2013-08-27
Semiconductor Device Including Cladded Base Plate App 20130134572 - Lenniger; Andreas ; et al.	2013-05-30
Semiconductor Device Including Cladded Base Plate App 20130062750 - Lenniger; Andreas ; et al.	2013-03-14

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