Uhara; Kenji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Uhara; Kenji.The latest application filed is for "multi-layer polyimide films and flexible circuit substrates therefrom".

Company Profile

0.5.8

Uhara; Kenji - Aich JP
Uhara; Kenji - Nagoya JP
Uhara; Kenji - Nagoya Aich JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-layer polyimide films and flexible circuit substrates therefrom Grant 7,452,610 - Uhara November 18, 2	2008-11-18
Electrically conductive polyimide compositions having a carbon nanotube filler component and methods relating thereto Grant 7,273,661 - Moriyama , et al. September 25, 2	2007-09-25
Multi-layer polyimide films and flexible circuit substrates therefrom App 20070003773 - Uhara; Kenji	2007-01-04
Polyamic acids, polyimide films and polymide-metal laminates and methods for making same App 20060009615 - Uhara; Kenji	2006-01-12
Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto Grant 6,916,544 - Moriyama , et al. July 12, 2	2005-07-12
Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate Grant 6,908,685 - Uhara , et al. June 21, 2	2005-06-21
Polyimide substrates having an interpenetrating network morphology and methods relating thereto Grant 6,828,390 - Uhara December 7, 2	2004-12-07
Electrically conductive polyimide compositions having a carbon nanotube filler component and methods relating thereto App 20040071990 - Moriyama, Hideki ; et al.	2004-04-15
Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate App 20040010113 - Uhara, Kenji ; et al.	2004-01-15
Polyimide substrates having an interpenetrating network morphology and methods relating thereto App 20030236359 - Uhara, Kenji	2003-12-25
Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto App 20030215654 - Moriyama, Hideki ; et al.	2003-11-20
Polyimide film, method of manufacture , and metal interconnect board with Polyimide film substrate App 20020045033 - Uhara, Kenji ; et al.	2002-04-18
Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate App 20020045054 - Uhara, Kenji ; et al.	2002-04-18

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