Ueshima; Minoru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ueshima; Minoru.The latest application filed is for "method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part".
Company Profile
10.44.44
- Ueshima; Minoru - Tokyo JP
- Ueshima; Minoru - Chiba JP
- Ueshima; Minoru - Matsudo JP
- Ueshima; Minoru - Matsudo-shi JP
- Ueshima; Minoru - Adachi-ku JP
- Ueshima; Minoru - Misato JP
- Ueshima; Minoru - Chiba-ken JP
- Ueshima; Minoru - Misato-shi JP
Patent Activity
| Patent | Date |
|---|---|
| Solder alloy for power devices and solder joint having a high current density Grant 11,331,759 - Albrecht , et al. May 17, 2 | 2022-05-17 |
| Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part Grant 11,217,359 - Jiu , et al. January 4, 2 | 2022-01-04 |
| Method For Synthesizing Copper-silver Alloy, Method For Forming Conduction Part, Copper-silver Alloy, And Conduction Part App 20210366627 - JIU; Jinting ; et al. | 2021-11-25 |
| Metallic sintered bonding body and die bonding method Grant 11,024,598 - Takemasa , et al. June 1, 2 | 2021-06-01 |
| Soldered joint and method for forming soldered joint Grant 10,968,932 - Ueshima , et al. April 6, 2 | 2021-04-06 |
| Solder Alloy for Power Devices and Solder Joint Having a High Current Density App 20210008670 - Albrecht; Hans-Jurgen ; et al. | 2021-01-14 |
| Method For Synthesizing Copper-silver Alloy, Method For Forming Conduction Part, Copper-silver Alloy, And Conduction Part App 20200381136 - JIU; Jinting ; et al. | 2020-12-03 |
| Soldered Joint And Method For Forming Soldered Joint App 20200284282 - UESHIMA; Minoru ; et al. | 2020-09-10 |
| Method of manufacturing permanent magnet Grant 10,658,107 - Sakuma , et al. | 2020-05-19 |
| Metallic Sintered Bonding Body And Die Bonding Method App 20190393188 - TAKEMASA; Tetsu ; et al. | 2019-12-26 |
| Method for soldering surface-mount component and surface-mount component Grant 10,354,944 - Ueshima , et al. July 16, 2 | 2019-07-16 |
| Electronic device including soldered surface-mount component Grant 10,297,539 - Ueshima , et al. | 2019-05-21 |
| Solder alloy, and LED module Grant 10,272,527 - Ueshima , et al. | 2019-04-30 |
| Solder alloy and module Grant 10,265,807 - Ueshima , et al. | 2019-04-23 |
| Method of forming solder bump, and solder bump Grant 10,090,268 - Sekimoto , et al. October 2, 2 | 2018-10-02 |
| Solder Alloy for LED, and LED Module App 20180264601 - Ueshima; Minoru ; et al. | 2018-09-20 |
| Method of Manufacturing Permanent Magnet App 20180102214 - Sakuma; Daisuke ; et al. | 2018-04-12 |
| Method of mounting electronic component to circuit board Grant 9,807,889 - Fujimoto , et al. October 31, 2 | 2017-10-31 |
| High-temperature lead-free solder alloy Grant 9,796,053 - Fujimaki , et al. October 24, 2 | 2017-10-24 |
| Solder Alloy for LED, and LED Module App 20170014955 - UESHIMA; Minoru ; et al. | 2017-01-19 |
| Electroconductive bonding material Grant 9,487,846 - Ueshima , et al. November 8, 2 | 2016-11-08 |
| Electroconductive Bonding Material App 20160010179 - Ueshima; Minoru ; et al. | 2016-01-14 |
| Lead-free solder alloy having reduced shrinkage cavities Grant 9,227,258 - Kawamata , et al. January 5, 2 | 2016-01-05 |
| Bi--Sn based high-temperature solder alloy Grant 9,205,513 - Ueshima , et al. December 8, 2 | 2015-12-08 |
| Method of Forming Solder Bump, and Solder Bump App 20150333027 - Sekimoto; Yasuyuki ; et al. | 2015-11-19 |
| Lead-free solder paste Grant 9,185,812 - Ueshima November 10, 2 | 2015-11-10 |
| Solder paste and solder joint Grant 9,162,324 - Nakano , et al. October 20, 2 | 2015-10-20 |
| Electronic Device Including Soldered Surface-mount Component App 20150262926 - UESHIMA; Minoru ; et al. | 2015-09-17 |
| High-temperature Lead-free Solder Alloy App 20150217410 - Fujimaki; Rei ; et al. | 2015-08-06 |
| Lead-free solder connection structure and solder ball Grant 8,975,757 - Ueshima , et al. March 10, 2 | 2015-03-10 |
| Indium-containing lead-free solder for vehicle-mounted electronic circuits Grant 8,888,932 - Kawamata , et al. November 18, 2 | 2014-11-18 |
| High-temperature lead-free solder alloy Grant 8,865,062 - Ueshima , et al. October 21, 2 | 2014-10-21 |
| Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solder Grant 8,845,826 - Kawamata , et al. September 30, 2 | 2014-09-30 |
| Process for producing a solder preform having high-melting metal particles dispersed therein Grant 8,790,472 - Ueshima , et al. July 29, 2 | 2014-07-29 |
| Audio Solder Alloy App 20140186208 - Akagi; Ippei ; et al. | 2014-07-03 |
| Solder Alloy for Power Devices and Solder Joint Having a High Current Density App 20140112710 - Albrecht; Hans-Jurgen ; et al. | 2014-04-24 |
| High-temperature Lead-free Solder Alloy App 20140044479 - Ueshima; Minoru ; et al. | 2014-02-13 |
| Method Of Mounting Electronic Component, Circuit Board, Solder Joint Portion, Printed Wiring Board With Connecting Layer, And Sheet-like Joint Member App 20140029224 - FUJIMOTO; Kozo ; et al. | 2014-01-30 |
| Bi-Sn Based High-Temperature Solder Alloy App 20130121874 - Ueshima; Minoru ; et al. | 2013-05-16 |
| Anisotropic conductive material Grant 8,343,383 - Ueshima January 1, 2 | 2013-01-01 |
| Power semiconductor device and manufacturing method therefor Grant 8,334,598 - Nishibori , et al. December 18, 2 | 2012-12-18 |
| Method For Soldering Surface-mount Component And Surface-mount Component App 20120292087 - Ueshima; Minoru ; et al. | 2012-11-22 |
| Lead-free low-temperature solder Grant 8,303,735 - Ueshima November 6, 2 | 2012-11-06 |
| Lead-free solder alloy Grant 8,216,395 - Munekata , et al. July 10, 2 | 2012-07-10 |
| Lead-free Solder Alloy Having Reduced Shrinkage Cavities App 20110204121 - Kawamata; Yuji ; et al. | 2011-08-25 |
| Lead-free Solder Connection Structure And Solder Ball App 20110115084 - Ueshima; Minoru ; et al. | 2011-05-19 |
| Power Semiconductor Device And Manufacturing Method Therefor App 20110089568 - NISHIBORI; Hiroshi ; et al. | 2011-04-21 |
| Indium-containing Lead-free Solder For Vehicle-mounted Electronic Circuits App 20100307823 - Kawamata; Yuji ; et al. | 2010-12-09 |
| Lead-free Solder For Vehicles And An Vehicle-mounted Electronic Circuit App 20100294565 - Kawamata; Yuji ; et al. | 2010-11-25 |
| Lead-free solder alloy App 20100297470 - Munekata; Osamu ; et al. | 2010-11-25 |
| Solder preform and electronic component Grant 7,800,230 - Hirano , et al. September 21, 2 | 2010-09-21 |
| Lead-free solder alloy Grant 7,682,468 - Munekata , et al. March 23, 2 | 2010-03-23 |
| Anisotropic Conductive Material App 20100053924 - Ueshima; Minoru | 2010-03-04 |
| Lead-free Low-temperature Solder App 20100015004 - Ueshima; Minoru | 2010-01-21 |
| Solder Paste and Solder Joint App 20090301607 - Nakano; Kosuke ; et al. | 2009-12-10 |
| Lead-free solder paste App 20090301606 - Ueshima; Minoru | 2009-12-10 |
| Method of replenishing an oxidation suppressing element in a solder bath Grant 7,628,308 - Ojima , et al. December 8, 2 | 2009-12-08 |
| Solder Preform and Electronic Component App 20090236725 - Hirano; Naohiko ; et al. | 2009-09-24 |
| Method for increasing the effectiveness of a component of a material App 20090236013 - Ueshima; Minoru | 2009-09-24 |
| Method for increasing the effectiveness of a component of a material Grant 7,537,728 - Ueshima May 26, 2 | 2009-05-26 |
| Process For Producing A Solder Preform Having High-melting Metal Particles Dispersed Therein App 20090014092 - Ueshima; Minoru ; et al. | 2009-01-15 |
| Pouring apparatus for molten metal and casting method Grant 7,451,805 - Ueshima November 18, 2 | 2008-11-18 |
| Soldering Method, Solder Pellet for Die Bonding, Method for Manufacturing a Solder Pellet for Die Bonding, and Electronic Component App 20080246164 - Ueshima; Minoru | 2008-10-09 |
| Pouring Apparatus for Molten Metal and Casting Method App 20080128105 - Ueshima; Minoru | 2008-06-05 |
| Lead-free solder alloy App 20080061117 - Munekata; Osamu ; et al. | 2008-03-13 |
| Lead-free solder alloy Grant 7,338,567 - Munekata , et al. March 4, 2 | 2008-03-04 |
| Lead-free solder Grant 7,282,175 - Amagai , et al. October 16, 2 | 2007-10-16 |
| Lead-free solder alloy Grant 7,029,542 - Amagai , et al. April 18, 2 | 2006-04-18 |
| Soldering method and solder alloy for additional supply App 20060011709 - Ojima; Masayuki ; et al. | 2006-01-19 |
| Lead-free solder alloy App 20050036902 - Amagai, Masazumi ; et al. | 2005-02-17 |
| Method for increasing the effectiveness of a component of a material App 20050005736 - Ueshima, Minoru | 2005-01-13 |
| Lead-free solder App 20040262779 - Amagai, Masazumi ; et al. | 2004-12-30 |
| Lead-free solder alloy App 20040062679 - Munekata, Osamu ; et al. | 2004-04-01 |
| Lead-free solder alloy App 20030021718 - Munekata, Osamu ; et al. | 2003-01-30 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 