UENO; Yukihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for UENO; Yukihiro.The latest application filed is for "method of fabricating printed wiring board".

Company Profile

0.6.18

UENO; Yukihiro - Hiroshima JP
UENO; Yukihiro - Mihara-shi JP
Ueno; Yukihiro - Niigata JP
Ueno; Yukihiro - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Fabricating Printed Wiring Board App 20090289030 - UENO; Yukihiro	2009-11-26
Printed Wiring Board App 20090114428 - UENO; Yukihiro	2009-05-07
Multilayer circuit board and production method for same Grant 7,525,188 - Ueno , et al. April 28, 2	2009-04-28
Multilayer Printed Wiring Board And Method For Fabrication Thereof App 20090084583 - UENO; Yukihiro	2009-04-02
Method for producing printed wiring board Grant 7,455,533 - Ueno November 25, 2	2008-11-25
Method for manufacturing multilayer printed wiring board App 20080286696 - Ueno; Yukihiro ; et al.	2008-11-20
Method For Manufacturing Multilayer Printed Wiring Board App 20080202676 - UENO; Yukihiro ; et al.	2008-08-28
Method For Manufacturing Multilayer Printed Wiring Board App 20080171139 - UENO; Yukihiro ; et al.	2008-07-17
Printed Wiring Board Manufacturing Apparatus, Printed Wiring Board, Method For Manufacturing Printed Wiring Board, And Electronic Device App 20080118681 - UENO; Yukihiro	2008-05-22
Method for producing multilayer printed wiring board, multilayer printed wiring board, and electronic device Grant 7,240,431 - Ueno July 10, 2	2007-07-10
Multilayer printed wiring board and method for producing the same App 20070117261 - Ueno; Yukihiro ; et al.	2007-05-24
Method for producing a multilayer printed wiring board App 20070089826 - Ueno; Yukihiro ; et al.	2007-04-26
Method of soldering semiconductor part and mounted structure of semiconductor part Grant 7,199,329 - Mano , et al. April 3, 2	2007-04-03
Multilayer circuit board and production method for same App 20070063355 - Ueno; Yukihiro ; et al.	2007-03-22
Printed wiring board fabrication method, printed wiring board photomask, and program for creating a photomask App 20070034596 - Ueno; Yukihiro ; et al.	2007-02-15
Multilayer printed wiring board fabrication method and multilayer printed wiring board App 20070017698 - Ueno; Yukihiro	2007-01-25
Printed wiring substrate and method for identifying printed wiring substrate App 20060157270 - Ueno; Yukihiro	2006-07-20
Method for producing printed wiring board App 20060108145 - Ueno; Yukihiro	2006-05-25
Method for producing multilayer printed wiring board, multilayer printed wiring board, and electronic device App 20060086535 - Ueno; Yukihiro	2006-04-27
Circuit board transferring apparatus and method and solder ball mounting method Grant 6,976,616 - Mano , et al. December 20, 2	2005-12-20
Wiring board with built-in electronic component and method for producing the same Grant 6,948,944 - Ueno September 27, 2	2005-09-27
Method Of Soldering Semiconductor Part And Mounted Structure Of Semiconductor Part App 20050035184 - Mano, Akihiro ; et al.	2005-02-17
Circuit Board Transferring Apparatus And Method And Solder Ball Mounting Method App 20050035182 - Mano, Akihiro ; et al.	2005-02-17
Wiring board with built-in electronic component and method for producing the same App 20030087538 - Ueno, Yukihiro	2003-05-08

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