Ueno; Seigo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ueno; Seigo.The latest application filed is for "wiring board".
- Ueno; Seigo - Iwakura JP
- UENO; Seigo - Iwakura-shi JP
- Ueno; Seigo - Ichinomiya JP
- UENO; Seigo - Ichinomiya-shi JP
| Patent | Date |
|---|---|
| Wiring board having a reinforcing member with capacitors incorporated therein Grant 8,964,403 - Ueno February 24, 2 | 2015-02-24 |
| Wiring Board App 20120120614 - UENO; Seigo | 2012-05-17 |
| Intermediate multilayer wiring board product, and method for manufacturing multilayer wiring board Grant 7,977,580 - Ueno , et al. July 12, 2 | 2011-07-12 |
| Intermediate Multilayer Wiring Board Product, And Method For Manufacturing Multilayer Wiring Board App 20090294156 - UENO; Seigo ; et al. | 2009-12-03 |
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