Ueno; Hiroumi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ueno; Hiroumi.The latest application filed is for "splitting method for optical device wafer".
- Ueno; Hiroumi - Ota-Ku N/A JP
| Patent | Date |
|---|---|
| Splitting method for optical device wafer Grant 8,946,056 - Ueno , et al. February 3, 2 | 2015-02-03 |
| Sapphire wafer dividing method Grant 8,518,730 - Hoshino , et al. August 27, 2 | 2013-08-27 |
| Splitting Method For Optical Device Wafer App 20120289026 - Ueno; Hiroumi ; et al. | 2012-11-15 |
| Sapphire Wafer Dividing Method App 20120083059 - Hoshino; Hitoshi ; et al. | 2012-04-05 |
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