| Patent | Date |
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Thermosetting resin sheet for sealing electronic component, resin-sealed type semiconductor device, and method for producing resin-sealed type semiconductor device
Grant 9,147,625 - Shimizu , et al. September 29, 2 | 2015-09-29 |
Film for the backside of flip-chip type semiconductor, dicing tape-integrated film for the backside of semiconductor, method of manufacturing film for the backside of flip-chip type semiconductor, and semiconductor device
Grant 8,841,757 - Uenda , et al. September 23, 2 | 2014-09-23 |
Thermally-detachable Sheet
App 20140249269 - Uenda; Daisuke ; et al. | 2014-09-04 |
Laminate
App 20140106133 - Torinari; Tsuyoshi ; et al. | 2014-04-17 |
Cleaning Sheet, Carrying Member With A Cleaning Function And Method Of Cleaning Substrate Processing Equipment
App 20140090196 - TERADA; Yoshio ; et al. | 2014-04-03 |
Cleaning Sheet, Carrying Member With A Cleaning Function And Method Of Cleaning Substrate Processing Equipment
App 20140090199 - TERADA; Yoshio ; et al. | 2014-04-03 |
Thermosetting Resin Sheet For Sealing Electronic Component, Resin-sealed Type Semiconductor Device, And Method For Producing Resin-sealed Type Semiconductor Device
App 20140061955 - Shimizu; Yusaku ; et al. | 2014-03-06 |
Method Of Manufacturing Semiconductor Element
App 20140004683 - Akizuki; Shinya ; et al. | 2014-01-02 |
Method Of Manufacturing An Led
App 20140000793 - TAKAHASHI; Tomokazu ; et al. | 2014-01-02 |
Method Of Manufacturing An Led
App 20140004635 - TAKAHASHI; Tomokazu ; et al. | 2014-01-02 |
Method Of Manufacturing An Led
App 20140004636 - TAKAHASHI; Tomokazu ; et al. | 2014-01-02 |
Method Of Manufacturing An Led
App 20140004637 - Takahashi; Tomokazu ; et al. | 2014-01-02 |
Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus
Grant 8,524,007 - Uenda , et al. September 3, 2 | 2013-09-03 |
Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus
Grant 8,475,600 - Uenda , et al. July 2, 2 | 2013-07-02 |
Cleaning Sheet, Cleaning Member, Cleaning Method, And Continuity Test Apparatus
App 20120280706 - Uenda; Daisuke ; et al. | 2012-11-08 |
Die Bond Film, Dicing Die Bond Film, Method Of Manufacturing Die Bond Film, And Semiconductor Device Having Die Bond Film
App 20120126379 - UENDA; Daisuke ; et al. | 2012-05-24 |
Adhesive Film For Semiconductor Device, And Semiconductor Device
App 20120126381 - UENDA; Daisuke ; et al. | 2012-05-24 |
Film For The Backside Of Flip-chip Type Semiconductor, Dicing Tape-integrated Film For The Backside Of Semiconductor, Method Of Manufacturing Film For The Backside Of Flip-chip Type Semiconductor, And Semiconductor Device
App 20120126380 - UENDA; Daisuke ; et al. | 2012-05-24 |
Cleaning Sheet, Transfer Member With Cleaning Function, Cleaning Method Of Substrate Processing Apparatus, And Substrate Processing Apparatus
App 20120042902 - Uenda; Daisuke | 2012-02-23 |
Cleaning Sheet, Transfer Member Provided With Cleaning Function, And Method For Cleaning Substrate Processing Apparatus
App 20110088721 - Uenda; Daisuke ; et al. | 2011-04-21 |
Cleaning Sheet, Conveying Member Using The Same, And Substrate Processing Equipment Cleaning Method Using Them
App 20100319151 - Namikawa; Makoto ; et al. | 2010-12-23 |
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them
Grant 7,793,668 - Namikawa , et al. September 14, 2 | 2010-09-14 |
Cleaning Member, Delivery Member with Cleaning Function, and Method of Cleaning Substrate Processing Apparatus
App 20100175716 - Sugo; Yuki ; et al. | 2010-07-15 |
Cleaning Sheet, Transfer Member Provided With Cleaning Function, And Method For Cleaning Substrate Processing Apparatus
App 20090263153 - Uenda; Daisuke ; et al. | 2009-10-22 |
Cleaning Substrate Of Substrate Processing Equipment And Heat Resistant Resin Preferable Thereof
App 20090253891 - TERADA; Yoshio ; et al. | 2009-10-08 |
Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor
Grant 7,575,812 - Terada , et al. August 18, 2 | 2009-08-18 |
Cleaning member for semiconductor apparatus and process for producing the same
App 20070163621 - Ishizaka; Hitoshi ; et al. | 2007-07-19 |
Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor
App 20060141258 - Terada; Yoshio ; et al. | 2006-06-29 |
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them
App 20060105164 - Namikawa; Makoto ; et al. | 2006-05-18 |
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them
App 20050244632 - Namikawa, Makoto ; et al. | 2005-11-03 |
Method of manufacturing double-sided circuit board
Grant 6,889,432 - Naito , et al. May 10, 2 | 2005-05-10 |
Cleaning sheet, carrying member with a cleaning function and method of cleaning substrate processing equipment
App 20040204334 - Terada, Yoshio ; et al. | 2004-10-14 |
Liquid crystal cell substrate including resin substrate, gas barrier layer, crosslinked resin layer and polarizing layer
Grant 6,798,487 - Ohtani , et al. September 28, 2 | 2004-09-28 |
Method for manufacturing double-sided circuit board
App 20030221314 - Naito, Toshiki ; et al. | 2003-12-04 |
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