loadpatents
name:-0.036488056182861
name:-0.029004096984863
name:-0.001488208770752
UEKI; Hiroshi Patent Filings

UEKI; Hiroshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for UEKI; Hiroshi.The latest application filed is for "laminated coil component".

Company Profile
1.29.47
  • UEKI; Hiroshi - Nagaokakyo-shi JP
  • UEKI; Hiroshi - Ichihara-shi Chiba
  • Ueki; Hiroshi - Nagaokakyo JP
  • Ueki; Hiroshi - Tokyo JP
  • UEKI; Hiroshi - Kawasaki-shi JP
  • Ueki; Hiroshi - Ichihara JP
  • Ueki; Hiroshi - Chiba N/A JP
  • Ueki; Hiroshi - Chiba Prefecture JP
  • Ueki; Hiroshi - Hyogo JP
  • Ueki; Hiroshi - Fussa JP
  • Ueki; Hiroshi - Itami JP
  • Ueki; Hiroshi - Ebina JP
  • Ueki; Hiroshi - Yokohama JA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Laminated Coil Component
App 20220189674 - SUZUKI; Yuudai ;   et al.
2022-06-16
Curable Organopolysiloxane Composition For Forming Films, And Method For Producing Organopolysiloxane Cured Film
App 20220089840 - FUKUI; Hiroshi ;   et al.
2022-03-24
Common-mode Choke Coil
App 20220044858 - MATSUURA; Kouhei ;   et al.
2022-02-10
Common-mode Choke Coil
App 20220044862 - MATSUURA; Kouhei ;   et al.
2022-02-10
Common-mode Choke Coil
App 20220044857 - MATSUURA; Kouhei ;   et al.
2022-02-10
Coil component
Grant 11,127,528 - Tsuduki , et al. September 21, 2
2021-09-21
Common-mode Choke Coil
App 20210241970 - MATSUURA; Kouhei ;   et al.
2021-08-05
Common-mode Choke Coil
App 20210241957 - MATSUURA; Kouhei ;   et al.
2021-08-05
Common-mode Choke Coil
App 20210241969 - MATSUURA; Kouhei ;   et al.
2021-08-05
Common-mode Choke Coil
App 20210241958 - MATSUURA; Kouhei ;   et al.
2021-08-05
Common-mode Choke Coil
App 20210241959 - MATSUURA; Kouhei ;   et al.
2021-08-05
Coil Component
App 20190206612 - TSUDUKI; Keiichi ;   et al.
2019-07-04
Semiconductor device and control method thereof
Grant 10,268,576 - Ueki , et al.
2019-04-23
Correlation operation circuit and semiconductor device
Grant 10,152,456 - Ueki Dec
2018-12-11
Semiconductor Device And Control Method Thereof
App 20180341581 - Ueki; Hiroshi ;   et al.
2018-11-29
Correlation Operation Circuit And Semiconductor Device
App 20170337158 - UEKI; Hiroshi
2017-11-23
Semiconductor Device, Semiconductor System, And Control Method Of Semiconductor Device
App 20170177062 - UEKI; Hiroshi
2017-06-22
Semiconductor Device
App 20170076102 - ISHIHARA; Kuniyasu ;   et al.
2017-03-16
Semiconductor device, electronic device and sensing method
Grant 9,344,101 - Ueki May 17, 2
2016-05-17
Semiconductor Device, Electronic Device And Sensing Method
App 20160056828 - UEKI; Hiroshi
2016-02-25
Method of Designing Semiconductor Device, Designing Assistance Program, Designing Apparatus, and Semiconductor Device
App 20150161307 - UEKI; Hiroshi
2015-06-11
Method of manufacturing a semiconductor device and a semiconductor device produced thereby
Grant 8,802,506 - Isshiki , et al. August 12, 2
2014-08-12
Silicon-containing polymer, method of manufacturing thereof, and curable polymer composition
Grant 8,674,037 - Morita , et al. March 18, 2
2014-03-18
Curable silicone composition and cured product thereof
Grant 8,563,666 - Morita , et al. October 22, 2
2013-10-22
Curable silicone composition and cured product therefrom
Grant 8,309,652 - Morita , et al. November 13, 2
2012-11-13
Curable epoxy resin composition and cured product thereof
Grant 8,227,528 - Morita , et al. July 24, 2
2012-07-24
Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promotor
Grant 8,063,143 - Morita , et al. November 22, 2
2011-11-22
Adhesion-promoting agent, curable organopolysiloxane composition, and semiconductor device
Grant 8,044,162 - Morita , et al. October 25, 2
2011-10-25
Silicon-containing Polymer, Method Of Manufacturing Thereof, And Curable Polymer Composition
App 20110118413 - Morita; Yoshitsugu ;   et al.
2011-05-19
Curable Organopolysiloxane Composition, Method of Curing Thereof, Semiconductor Device, And Adhesion Promotor
App 20110071266 - Morita; Yoshitsugu ;   et al.
2011-03-24
Organopolysiloxane and curable silicone composition that contains aforementioned organopolysiloxane
Grant 7,863,391 - Morita , et al. January 4, 2
2011-01-04
Curing silicone composition and cured product thereof
Grant 7,863,399 - Morita , et al. January 4, 2
2011-01-04
Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter
Grant 7,842,755 - Morita , et al. November 30, 2
2010-11-30
Curable Liquid Epoxy Resin Composition and Cured Product Thereof
App 20100292400 - Morita; Yoshitsugu ;   et al.
2010-11-18
Curable Epoxy Resin Composition and Cured Body Thereof
App 20100234520 - Morita; Yoshitsugu ;   et al.
2010-09-16
Curable Epoxy Resin Composition and Cured Product Thereof
App 20100216913 - Morita; Yoshitsugu ;   et al.
2010-08-26
Method Of Manufacturing A Semiconductor Device And A Semiconductor Device Produced Thereby
App 20100213623 - Isshiki; Minoru ;   et al.
2010-08-26
Curable Silicone Composition And Cured Product Thereof
App 20100213404 - Morita; Yoshitsugu ;   et al.
2010-08-26
Curable silicone composition and cured product thereof
Grant 7,781,522 - Morita , et al. August 24, 2
2010-08-24
Cross-linked Silicone Particles And Method Of Manufacturing Thereof
App 20100209707 - Morita; Yoshitsugu ;   et al.
2010-08-19
Curable Epoxy Resin Composition, Cured Body Thereof, and Use Thereof
App 20100144928 - Morita; Yoshitsugu ;   et al.
2010-06-10
Curable Silicone Composition And Cured Body Thereof
App 20100022704 - Morita; Yoshitsugu ;   et al.
2010-01-28
Adhesive-Promoting Agent, Curable Organopolysiloxane Composition, and Semiconductor Device
App 20090294796 - Morita; Yoshitsugu ;   et al.
2009-12-03
Curable Silicone Composition And Cured Product Therefrom
App 20090247681 - Morita; Yoshitsugu ;   et al.
2009-10-01
Organotrisiloxane, Preparation And Use In Curable Resin Composition
App 20090234078 - Ueki; Hiroshi ;   et al.
2009-09-17
Curable Silicone Composition And Electronic Device Produced Therefrom
App 20090214870 - Morita; Yoshitsugu ;   et al.
2009-08-27
Silicone Resin Composition, Curable Resin Composition, and Cured Resin
App 20080319144 - Morita; Yoshitsugu ;   et al.
2008-12-25
Curable Organopolysiloxane Composition, Method of Curing Thereof, Semiconductor Device, and Adhesion Promoter
App 20080262158 - Morita; Yoshitsugu ;   et al.
2008-10-23
Organopolysiloxane and Curable Silicone Composition that Contains Aforementioned Organopolysiloxane
App 20080207848 - Morita; Yoshitsugu ;   et al.
2008-08-28
Curing Silicone Composition and Cured Product Thereof
App 20070282058 - Morita; Yoshitsugu ;   et al.
2007-12-06
Curable Silicone Composition and Cured Product Thereof
App 20070225437 - Morita; Yoshitsugu ;   et al.
2007-09-27
Silicone resin composition, curable resin composition, and curable resin
Grant 7,138,467 - Furukawa , et al. November 21, 2
2006-11-21
Curable epoxy resin composition
Grant 7,105,614 - Morita , et al. September 12, 2
2006-09-12
Silicone resin composition, curable resin composition, and curable resin
App 20050080204 - Furukawa, Haruhiko ;   et al.
2005-04-14
Curable epoxy resin composition
App 20040198925 - Morita, Yoshitsugu ;   et al.
2004-10-07
Microprocessor performing pipeline processing of a plurality of stages
App 20040111592 - Nagao, Chuma ;   et al.
2004-06-10
Flame-retardant thermoplastic resin composition and manufacturing method thereof
Grant 6,699,925 - Hatanaka , et al. March 2, 2
2004-03-02
Microprocessor
App 20040019772 - Ueki, Hiroshi ;   et al.
2004-01-29
Additive for organic resin and organic resin composition
Grant 6,660,807 - Morita , et al. December 9, 2
2003-12-09
Microcomputer including download circuit controlling data download to plurality of memories
Grant 6,651,152 - Ueki , et al. November 18, 2
2003-11-18
Thermoplastic resin composition and moldings therefrom
Grant 6,590,032 - Furukawa , et al. July 8, 2
2003-07-08
Polyolefin-based resin composition and process for production thereof
App 20030114569 - Morita, Yoshitsugu ;   et al.
2003-06-19
Additive for organic resin and organic resin composition
App 20020151633 - Morita, Yoshitsugu ;   et al.
2002-10-17
Flame retardant organic resin composition
App 20020077400 - Nakanishi, Koji ;   et al.
2002-06-20
Flame-retardant thermoplastic resin composition and manufacturing method thereof
App 20020045695 - Hatanaka, Hidekatsu ;   et al.
2002-04-18
Thermoplastic resin composition and moldings therefrom
App 20020040101 - Furukawa, Haruhiko ;   et al.
2002-04-04
Flame-retardant polyolefin-based resin composition, method manufacturing, and flame-retardant cable therefrom
App 20020013395 - Hatanaka, Hidekatsu ;   et al.
2002-01-31
Flame retardant organic resin composition
App 20010044484 - Hatanaka, Hidekatsu ;   et al.
2001-11-22
Scroll control for a table display
Grant 6,065,022 - Ueki May 16, 2
2000-05-16
Non-volatile semiconductor storage apparatus
Grant 5,671,177 - Ueki September 23, 1
1997-09-23
Thermoplastic resin composition
Grant 5,654,366 - Furukawa , et al. August 5, 1
1997-08-05
Self-adjustable double linear motion guide unit assembly
Grant 5,158,372 - Ueki October 27, 1
1992-10-27
Sound Generating Device
Grant 3,761,956 - Takahashi , et al. September 25, 1
1973-09-25

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