Ueji; Kenji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ueji; Kenji.The latest application filed is for "self-curable water-based solid adhesive and bonding method using the self-curable water-based solid adhesive".

Company Profile

0.5.2

Ueji; Kenji - Osaka JP
Ueji, Kenji - Osaka-shi JP
Ueji; Kenji - Kawachinagano JP
Ueji; Kenji - Sakai JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Self-curable water-based solid adhesive and bonding method using the self-curable water-based solid adhesive Grant 7,863,374 - Shibahara , et al. January 4, 2	2011-01-04
Self-curable water-based solid adhesive and bonding method using the self-curable water-based solid adhesive App 20080119607 - Shibahara; Syunsuke ; et al.	2008-05-22
Self-reactive/curable water-based solid adhesive and method of bonding with the self-reactive/curable water-based solid adhesive Grant 7,084,203 - Shibahara , et al. August 1, 2	2006-08-01
Self-reactive/curable water-based solid adhesive and method of bonding with the self-reactive/curable water-based solid adhesive App 20040132864 - Shibahara, Syunsuke ; et al.	2004-07-08
Agent for water-repellent treatment of fibers Grant 5,612,433 - Ono , et al. March 18, 1	1997-03-18
Agent for water-repellent treatment of fibers Grant 5,576,096 - Ono , et al. November 19, 1	1996-11-19
Felt-tipped pen type adhesive applier Grant 5,411,345 - Ueji , et al. May 2, 1	1995-05-02

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