Uehling; Trent
Patent Applications and Registrations
Patent applications and USPTO patent grants for Uehling; Trent.The latest application filed is for "device package substrate structure and method therefor".
- Uehling; Trent - New Braunfels TX
- Uehling; Trent - Austin TX
| Patent | Date |
|---|---|
| Device Package Substrate Structure And Method Therefor App 20220059441 - Foong; Chee Seng ; et al. | 2022-02-24 |
| Method of fabricating embedded traces Grant 11,018,024 - Uehling , et al. May 25, 2 | 2021-05-25 |
| Substrate With Embedded Traces App 20200043750 - Uehling; Trent ; et al. | 2020-02-06 |
| Multiple interconnections between die Grant 10,037,970 - Clegg , et al. July 31, 2 | 2018-07-31 |
| Laser sintered interconnections between die Grant 9,935,079 - Foong , et al. April 3, 2 | 2018-04-03 |
| Multiple Interconnections Between Die App 20180068980 - Clegg; David ; et al. | 2018-03-08 |
| Wire bonding capillary with working tip protrusion Grant 9,093,515 - Uehling , et al. July 28, 2 | 2015-07-28 |
| Wire Bonding Capillary With Working Tip Protrusion App 20150021376 - Uehling; Trent ; et al. | 2015-01-22 |
| Interconnect system and method of fabrication App 20030006062 - Stone, William M. ; et al. | 2003-01-09 |
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