UEDA, YOUICHI
Patent Applications and Registrations
Patent applications and USPTO patent grants for UEDA, YOUICHI.The latest application filed is for "novel aryl ester compound, its production process , epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition".
- UEDA, YOUICHI - TAKATSUKI-SHI JP
- Ueda; Youichi - Shibata-machi JP
- Ueda; Youichi - Kashihara JP
- Ueda; Youichi - Kawasaki JP
| Patent | Date |
|---|---|
| Novel Aryl Ester Compound, Its Production Process , Epoxy Resin Composition Using Said Compound, And Copper-clad Laminate Using The Epoxy Resin Composition App 20020010288 - UEDA, YOUICHI ; et al. | 2002-01-24 |
| Image forming device which forms an electric field to discharge an object Grant 5,864,737 - Obu , et al. January 26, 1 | 1999-01-26 |
| Imide compound and composition containing the same Grant 4,960,860 - Saito , et al. * October 2, 1 | 1990-10-02 |
| Flavor enhancing seasoning containing deodorized garlic extract and process Grant 4,741,914 - Kimizuka , et al. May 3, 1 | 1988-05-03 |
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