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Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment App 20080185178 - Okimoto; Rikiya ;   et al. | 2008-08-07 |
Test Mark Structure, Substrate Sheet Laminate, Multilayered Circuit Substrate, Method For Inspecting Lamination Matching Precision Of Multilayered Circuit Substrate, And Method For Designing Substrate Sheet Laminate App 20080186045 - UEDA; Yoji ;   et al. | 2008-08-07 |
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Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment App 20050124197 - Okimoto, Rikiya ;   et al. | 2005-06-09 |
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Member for a circuit board, method of manufacturing the same, and methods of manufacturing circuit boards App 20040214006 - Hirayama, Kumiko ;   et al. | 2004-10-28 |
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Circuit board and production of the same App 20030066683 - Suzuki, Takeshi ;   et al. | 2003-04-10 |
Printed circuit board and method for producing the same App 20020192485 - Ochi, Shozo ;   et al. | 2002-12-19 |
Printed circuit board and method for producing the same Grant 6,459,046 - Ochi , et al. October 1, 2 | 2002-10-01 |
Circuit board and production of the same App 20020038725 - Suzuki, Takeshi ;   et al. | 2002-04-04 |
Printed circuit board and method for producing the same App 20020023777 - Ochi, Shozo ;   et al. | 2002-02-28 |
Printed circuit board and method of manufacturing the same App 20010052425 - Andoh, Daizo ;   et al. | 2001-12-20 |