loadpatents
name:-0.029742002487183
name:-0.019334077835083
name:-0.002640962600708
UEDA; Takehiko Patent Filings

UEDA; Takehiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for UEDA; Takehiko.The latest application filed is for "puncture needle".

Company Profile
2.16.19
  • UEDA; Takehiko - Kofu-shi JP
  • Ueda; Takehiko - Yamanashi JP
  • Ueda; Takehiko - Tokyo JP
  • Ueda; Takehiko - Yokohama JP
  • UEDA; Takehiko - Nakakoma-gun JP
  • UEDA; Takehiko - Yokohama-shi JP
  • Ueda; Takehiko - Kanagawa-ken JP
  • Ueda, Takehiko - Netagaya-ku JP
  • Ueda; Takehiko - Kyoto JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Puncture Needle
App 20210196886 - OSAWA; Kosuke ;   et al.
2021-07-01
Medical puncture needle
Grant 11,033,691 - Ueda June 15, 2
2021-06-15
Puncture Needle And Catheter Assembly
App 20200330014 - UEDA; Takehiko ;   et al.
2020-10-22
Medical puncture needle and method for manufacturing puncture needle
Grant 10,772,660 - Ueda September 15, 2
2020-09-15
Medical puncture needle and method for manufacturing puncture needle
Grant 10,722,264 - Ueda
2020-07-28
Medical puncture needle and method for manufacturing puncture needle
Grant 10,682,473 - Ueda
2020-06-16
Electronic Apparatus Activation Control Apparatus, Electronic Apparatus Activation Control System, Electronic Apparatus Activati
App 20190384241 - Yoshino; Masaharu ;   et al.
2019-12-19
Washing/drying apparatus, screening apparatus, washing/drying method, and screening method
Grant 10,429,402 - Isami , et al. October 1, 2
2019-10-01
Medical Puncture Needle
App 20190091415 - UEDA; Takehiko
2019-03-28
Medical Puncture Needle And Method For Manufacturing Puncture Needle
App 20180153579 - UEDA; Takehiko
2018-06-07
Medical Puncture Needle And Method For Manufacturing Puncture Needle
App 20180146983 - UEDA; Takehiko
2018-05-31
Medical Puncture Needle And Method For Manufacturing Puncture Needle
App 20170274153 - UEDA; Takehiko
2017-09-28
Washing/drying Apparatus, Screening Apparatus, Washing/drying Method, And Screening Method
App 20170045543 - ISAMI; Tadao ;   et al.
2017-02-16
Biochip Fixing Method, Biochip Fixing Device, And Screening Method For Biomolecule Array
App 20160059201 - UEDA; Takehiko ;   et al.
2016-03-03
Method for predicting worked shape, method for determining working conditions, working method, working system, semiconductor device manufacturing method, computer program and computer program storage medium
Grant 9,031,687 - Senga , et al. May 12, 2
2015-05-12
Electronic Apparatus Activation Control Apparatus, Electronic Apparatus Activation Control System, Electronic Apparatus Activation Control Method, And Program
App 20140058536 - Yoshino; Masaharu ;   et al.
2014-02-27
Optical Element, Optical Device, Measurement Device, And Screening Apparatus
App 20140027653 - MORI; Susumu ;   et al.
2014-01-30
Method for detecting polishing end in CMP polishing device, CMP polishing device, and semiconductor device manufacturing method
Grant 7,981,309 - Ueda , et al. July 19, 2
2011-07-19
Method For Predicting Worked Shape, Method For Determining Working Conditions, Working Method, Working System, Semiconductor Device Manufacturing Method, Computer Program And Computer Program Storage Medium
App 20100233937 - SENGA; Tatsuya ;   et al.
2010-09-16
Working shape prediction method, working requirement determination method, working method, working system, method of manufacturing semiconductor device, computer program, and computer program storage medium
Grant 7,686,673 - Senga , et al. March 30, 2
2010-03-30
Method for Detecting Polishing End in CMP Polishing Device, CMP Polishing Device, and Semiconductor Device Manufacturing Method
App 20090233525 - Ueda; Takehiko ;   et al.
2009-09-17
Chemical mechanical polishing end point detection apparatus and method
Grant 7,169,016 - Barada , et al. January 30, 2
2007-01-30
Chemical Mechanical Polishing End Point Detection Apparatus And Method
App 20060258263 - Barada; Andrew H. ;   et al.
2006-11-16
Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
Grant 7,052,920 - Ushio , et al. May 30, 2
2006-05-30
Process end point detection apparatus and method, polishing apparatus, semiconductor device manufacturing method, and recording medium recorded with signal processing program
Grant 6,963,407 - Abe , et al. November 8, 2
2005-11-08
Working shape prediction method, working requirement determination method, working method, working system, method of manufacturing semiconductor device, computer program, and computer program storage medium
App 20040053558 - Senga, Tatsuya ;   et al.
2004-03-18
Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
Grant 6,670,200 - Ushio , et al. December 30, 2
2003-12-30
Process end point detection apparatus and method, polishing apparatus, semiconductor device manufacturing method, and recording medium recorded with signal processing program
App 20030205664 - Abe, Hiroyuki ;   et al.
2003-11-06
Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
App 20020001862 - Ushio, Yoshijiro ;   et al.
2002-01-03
Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
App 20010039064 - Ushio, Yoshijiro ;   et al.
2001-11-08
Display Device And Camera Having The Display Device
App 20010011966 - IWANE, TORU ;   et al.
2001-08-09
Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
Grant 6,271,047 - Ushio , et al. August 7, 2
2001-08-07
Method for fabricating semiconductor device
Grant 6,180,472 - Akamatsu , et al. January 30, 2
2001-01-30
Controlling apparatus for high frequency high voltage power source for corona discharge processing
Grant 5,486,993 - Sakurai , et al. January 23, 1
1996-01-23

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