Ueda; Keiichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ueda; Keiichi.The latest application filed is for "coupler".
- Ueda; Keiichi - Higashi-Osaka JP
- Ueda; Keiichi - Kuwana JP
- UEDA; Keiichi - Higashi-Osaka-shi JP
- Ueda; Keiichi - Mie JP
- Ueda, Keiichi - Kuwana-shi JP
- Ueda; Keiichi - Gifu JP
- Ueda, Keiichi - Motosu-gun JP
| Patent | Date |
|---|---|
| Coupler Grant 10,047,906 - Shimonishi , et al. August 14, 2 | 2018-08-14 |
| Bearing performance automatic calculation service device Grant 9,906,473 - Toyoda , et al. February 27, 2 | 2018-02-27 |
| Coupler App 20170284598 - SHIMONISHI; Toru ; et al. | 2017-10-05 |
| Bearing Performance Automatic Calculation Service Device App 20160127285 - TOYODA; Satomi ; et al. | 2016-05-05 |
| Method of and device for lubricating rolling bearings Grant 7,374,019 - Kosugi , et al. May 20, 2 | 2008-05-20 |
| Angular ball bearing and rolling bearing Grant 7,287,910 - Kobayashi , et al. October 30, 2 | 2007-10-30 |
| Angular ball bearing and rolling bearing App 20060088235 - Ueda; Keiichi | 2006-04-27 |
| Rolling bearing lubricating method and device App 20050252722 - Kosugi, Futoshi ; et al. | 2005-11-17 |
| Rolling element retainer and rolling bearing assembly using the same App 20050063627 - Ueda, Keiichi ; et al. | 2005-03-24 |
| Method of fabricating semiconductor device having alignment mark Grant 6,841,451 - Okayama , et al. January 11, 2 | 2005-01-11 |
| Angular ball bearing and rolling bearing App 20040208408 - Kobayashi, Umemitsu ; et al. | 2004-10-21 |
| Method of fabricating semiconductor device having alignment mark App 20020142511 - Okayama, Yoshio ; et al. | 2002-10-03 |
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