Uebayashi; Tetsuya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Uebayashi; Tetsuya.The latest application filed is for "electronic package including cavity formed by removal of sacrificial material from within a cap".

Company Profile

2.10.12

Uebayashi; Tetsuya - Ibaraki JP
Uebayashi; Tetsuya - Ibaraki-Shi JP
Uebayashi; Tetsuya - Osaka-Fu JP
Uebayashi; Tetsuya - Kanagawa JP
Uebayashi; Tetsuya - Tokyo JP
Uebayashi; Tetsuya - Hyogo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic package including cavity defined by resin and method of forming same Grant 10,999,932 - Takano , et al. May 4, 2	2021-05-04
Electronic Package Including Cavity Formed By Removal Of Sacrificial Material From Within A Cap App 20200153407 - Takano; Atsushi ; et al.	2020-05-14
Electronic package including cavity formed by removal of sacrificial material from within a cap Grant 10,574,202 - Takano , et al. Feb	2020-02-25
Electronic Package Including Cavity Defined By Resin And Method Of Forming Same App 20190246500 - Takano; Atsushi ; et al.	2019-08-08
Electronic package including cavity defined by resin and method of forming same Grant 10,321,572 - Takano , et al.	2019-06-11
Electronic Package Including Cavity Formed By Removal Of Sacrificial Material From Within A Cap App 20170288627 - Takano; Atsushi ; et al.	2017-10-05
Electronic Package Including Cavity Defined By Resin And Method Of Forming Same App 20170290160 - Takano; Atsushi ; et al.	2017-10-05
Method for manufacturing semiconductor device Grant 8,318,548 - Yamashita , et al. November 27, 2	2012-11-27
Method For Manufacturing Semiconductor Device App 20110039376 - Yamashita; Kunihiro ; et al.	2011-02-17
Method of attaching a semiconductor chip to a chip mounting substrate Grant 7,028,397 - Abe , et al. April 18, 2	2006-04-18
Semiconductor apparatus utilizing a preparatory stage for a chip assembly Grant 6,995,468 - Abe , et al. February 7, 2	2006-02-07
Semiconductor device Grant 6,965,154 - Abe , et al. November 15, 2	2005-11-15
Lead frame Grant 6,867,507 - Uebayashi , et al. March 15, 2	2005-03-15
Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatus App 20040180468 - Abe, Shunichi ; et al.	2004-09-16
Semiconductor device App 20040178490 - Abe, Shunichi ; et al.	2004-09-16
Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatus Grant 6,784,021 - Abe , et al. August 31, 2	2004-08-31
Semiconductor device Grant 6,737,736 - Abe , et al. May 18, 2	2004-05-18
Lead frame App 20030062604 - Uebayashi, Tetsuya ; et al.	2003-04-03
Semiconductor device, method of producing the same and semiconductor production equipment for carrying out the method App 20030059981 - Abe, Shunichi ; et al.	2003-03-27
Semiconductor device, and method of manufacturing the semiconductor device App 20030054591 - Abe, Shunichi ; et al.	2003-03-20
Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatus App 20030049915 - Abe, Shunichi ; et al.	2003-03-13
Semiconductor device and manufacturing method thereof App 20020105061 - Abe, Shunichi ; et al.	2002-08-08

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