Udagawa; Yoshiaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Udagawa; Yoshiaki.The latest application filed is for "refrigeration system utilizing incomplete evaporation of refrigerant in evaporator".

Company Profile

0.12.5

Udagawa; Yoshiaki - Kawasaki JP
Udagawa, Yoshiaki - Kawasaki-Shi JP
UDAGAWA, YOSHIAKI - TOKYO JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator Grant 7,007,506 - Kubo , et al. March 7, 2	2006-03-07
Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator App 20040200229 - Kubo, Hideo ; et al.	2004-10-14
Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator Grant 6,748,755 - Kubo , et al. June 15, 2	2004-06-15
Liquid-cooled electronic apparatus Grant 6,621,707 - Ishimine , et al. September 16, 2	2003-09-16
Assembly including heat pipe and heat conductive member fixed to each other by plastic deformation of the latter, and method of manufacturing the assembly App 20030005584 - Komatsu, Noritoshi ; et al.	2003-01-09
Liquid-cooled electronic apparatus Grant 6,404,640 - Ishimine , et al. June 11, 2	2002-06-11
Liquid-cooled electronic apparatus App 20020021557 - Ishimine, Junichi ; et al.	2002-02-21
Method And Apparatus For Mounting Circuit Elements On A Printed Wiring Board App 20010039724 - OHSHIMA, OSAMU ; et al.	2001-11-15
Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator App 20010020365 - Kubo, Hideo ; et al.	2001-09-13
Printed wiring board with mounted circuit element using a terminal density conversion board Grant 5,936,843 - Ohshima , et al. August 10, 1	1999-08-10
Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer Grant 5,195,020 - Suzuki , et al. March 16, 1	1993-03-16
Cooling system for an electronic circuit device Grant 5,126,919 - Yamamoto , et al. June 30, 1	1992-06-30
Cooling system for an electronic circuit device Grant 4,920,574 - Yamamoto , et al. April 24, 1	1990-04-24
Cooling system for an electronic circuit device Grant 4,879,632 - Yamamoto , et al. November 7, 1	1989-11-07
Cooling system for an electronic circuit device Grant 4,783,721 - Yamamoto , et al. November 8, 1	1988-11-08
Cooling system for electronic circuit device Grant 4,729,060 - Yamamoto , et al. March 1, 1	1988-03-01
Printed circuit card construction Grant 4,158,220 - Yamamoto , et al. June 12, 1	1979-06-12

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