Uda; Takayuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Uda; Takayuki.The latest application filed is for "connector and an electronic apparatus having electronic parts connected to each other by the connector".

Company Profile

0.7.3

Uda; Takayuki - Hadano JP
Uda, Takayuki - Hadano-shi JP
Uda; Takayuki - Ohme JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sealing structure for multi-chip module Grant 7,518,233 - Takahashi , et al. April 14, 2	2009-04-14
Connector and an electronic apparatus having electronic parts connected to each other by the connector Grant 7,004,760 - Kawazoe , et al. February 28, 2	2006-02-28
Device for sealing and cooling multi-chip modules Grant 6,890,799 - Daikoku , et al. May 10, 2	2005-05-10
Connector and an electronic apparatus having electronic parts connected to each other by the connector App 20050020116 - Kawazoe, Katsuro ; et al.	2005-01-27
Device for sealing and cooling multi-chip modules App 20030103333 - Daikoku, Takahiro ; et al.	2003-06-05
Device for sealing and cooling multi-chip modules Grant 6,528,878 - Daikoku , et al. March 4, 2	2003-03-04
Input-output circuit cell and semiconductor integrated circuit apparatus App 20010022402 - Miyamoto, Kazuhisa ; et al.	2001-09-20
Electronic device bonding method and electronic circuit apparatus Grant 5,973,406 - Harada , et al. October 26, 1	1999-10-26
Method of manufacturing semiconductor integrated circuit device Grant 5,223,454 - Uda , et al. June 29, 1	1993-06-29
Method of manufacturing semiconductor integrated circuit device Grant 5,049,972 - Uda , et al. September 17, 1	1991-09-17

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