Uda; Minoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Uda; Minoru.The latest application filed is for "copper alloy".

Company Profile

0.6.4

Uda; Minoru - Nagoya JP
UDA; Minoru - Nagoya-City JP
Uda; Minoru - Mie JP
Uda, Minoru - Nagoya-Shi JP
Uda; Minoru - Handa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Copper nickel alloy Grant 10,072,321 - Uda , et al. September 11, 2	2018-09-11
Copper Alloy App 20160312340 - UDA; Minoru ; et al.	2016-10-27
Inspection device for headrest return prevention mechanism Grant 7,784,369 - Uda August 31, 2	2010-08-31
Material including beryllium intermetallic compound and having excellent high-temperature property applied to nuclear fusion reactor Grant 7,560,069 - Kawamura , et al. July 14, 2	2009-07-14
Inspection Device For Headrest Return Prevention Mechanism App 20090151481 - Uda; Minoru	2009-06-18
Material including beryllium intermetallic compound and having excellent high-temperature property applied to nuclear fusion reactor App 20050135960 - Kawamura, Hiroshi ; et al.	2005-06-23
Bonded body comprising beryllium member and copper or copper alloy member, and method of manufacturing the same Grant 6,824,888 - Hatano , et al. November 30, 2	2004-11-30
Bonded body comprising beryllium member and copper or copper alloy member, and method of manufacturing the same App 20030085260 - Hatano, Toshihisa ; et al.	2003-05-08
Pulp mold, a method, and a molding apparatus for producing fiber bodies, and a molded fiber body Grant 5,431,784 - Miyamoto , et al. July 11, 1	1995-07-11
Pulp molding die for molding shaped pulp articles, method, apparatus, and shaped pulp article Grant 5,399,243 - Miyamoto , et al. March 21, 1	1995-03-21

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