Uchiyama; Kenta

Patent Applications and Registrations

Patent applications and USPTO patent grants for Uchiyama; Kenta.The latest application filed is for "wiring substrate and semiconductor device".

Company Profile

0.15.13

Uchiyama; Kenta - Tempe AZ
UCHIYAMA; KENTA - TEMPLE AZ
Uchiyama; Kenta - Nagano JP
Uchiyama; Kenta - Nagano-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring substrate and semiconductor device Grant 9,899,304 - Imafuji , et al. February 20, 2	2018-02-20
Wiring Substrate And Semiconductor Device App 20170186677 - IMAFUJI; KEI ; et al.	2017-06-29
Electronic apparatus having a resin filled through electrode configured to go through first and second semiconductor components Grant 9,515,050 - Uchiyama , et al. December 6, 2	2016-12-06
Semiconductor package and method for manufacturing the semiconductor package Grant 9,136,220 - Uchiyama September 15, 2	2015-09-15
Semiconductor package and method for manufacturing the semiconductor package embedded with semiconductor chip Grant 9,041,211 - Uchiyama May 26, 2	2015-05-26
Electronic Apparatus And Fabrication Method Of The Same App 20140291865 - UCHIYAMA; Kenta ; et al.	2014-10-02
Stacked chips package having feed-through electrode connecting the first and second semiconductor components via an adhesive layer Grant 8,786,103 - Uchiyama , et al. July 22, 2	2014-07-22
Electric part package and manufacturing method thereof Grant 8,692,363 - Koizumi , et al. April 8, 2	2014-04-08
Semiconductor device and a method of manufacturing the same, and an electronic device Grant 8,450,853 - Uchiyama May 28, 2	2013-05-28
Semiconductor Package And Method For Manufacturing The Semiconductor Package App 20130069245 - UCHIYAMA; Kenta	2013-03-21
Semiconductor Package And Method For Manufacturing The Semiconductor Package App 20130069219 - UCHIYAMA; Kenta	2013-03-21
Wiring board with lead pins and method of producing the same Grant 8,314,347 - Uchiyama , et al. November 20, 2	2012-11-20
Semiconductor Package And Manufacturing Method Thereof App 20120119391 - KOIZUMI; Naoyuki ; et al.	2012-05-17
Electric Part Package And Manufacturing Method Thereof App 20120119379 - KOIZUMI; Naoyuki ; et al.	2012-05-17
Electronic device and method of manufacturing same Grant 8,174,109 - Uchiyama May 8, 2	2012-05-08
Semiconductor device, manufacturing method thereof, and electronic device Grant 8,169,072 - Uchiyama , et al. May 1, 2	2012-05-01
Electronic Apparatus And Fabrication Method Of The Same App 20100258944 - Uchiyama; Kenta ; et al.	2010-10-14
Semiconductor Device, Manufacturing Method Thereof, And Electronic Device App 20100258946 - UCHIYAMA; Kenta ; et al.	2010-10-14
Electronic Device And Method Of Manufacturing Same App 20100252937 - UCHIYAMA; Kenta	2010-10-07
Semiconductor Device And A Method Of Manufacturing The Same, And An Electronic Device App 20100213616 - UCHIYAMA; Kenta	2010-08-26
Wiring Board With Lead Pins And Method Of Producing The Same App 20100147561 - Uchiyama; Kenta ; et al.	2010-06-17

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