Uchimura; Teppei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Uchimura; Teppei.The latest application filed is for "method of etching of soi substrate, and back-illuminated photoelectric conversion module on soi substrate and process of manufacture thereof".
- Uchimura; Teppei - Hamamatsu N/A JP
- Uchimura; Teppei - Sendai JP
- Uchimura; Teppei - Hamamatsui-shi JP
- Uchimura; Teppei - Sendai-shi JP
| Patent | Date |
|---|---|
| Method of etching backside Si substrate of SOI substrate to expose SiO.sub.2 layer using fluonitric acid Grant 9,240,505 - Ohmi , et al. January 19, 2 | 2016-01-19 |
| Ultra high-speed wet etching apparatus Grant 8,728,338 - Ohmi , et al. May 20, 2 | 2014-05-20 |
| Method Of Etching Of Soi Substrate, And Back-illuminated Photoelectric Conversion Module On Soi Substrate And Process Of Manufacture Thereof App 20130320477 - Ohmi; Tadahiro ; et al. | 2013-12-05 |
| Ultra High-speed Wet Etching Apparatus App 20130244442 - Ohmi; Tadahiro ; et al. | 2013-09-19 |
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