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name:-0.014757871627808
name:-0.0041019916534424
name:-0.00053095817565918
Uchikura; Kazuhito Patent Filings

Uchikura; Kazuhito

Patent Applications and Registrations

Patent applications and USPTO patent grants for Uchikura; Kazuhito.The latest application filed is for "aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing".

Company Profile
0.5.10
  • Uchikura; Kazuhito - Yokkaichi N/A JP
  • UCHIKURA; Kazuhito - Yokkaichi-shi JP
  • Uchikura; Kazuhito - Mie-ken JP
  • Uchikura; Kazuhito - Chuo-ku JP
  • Uchikura, Kazuhito - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
Grant 8,506,359 - Shida , et al. August 13, 2
2013-08-13
Chemical mechanical polishing aqueous dispersion preparation set, method of preparing chemical mechanical polishing aqueous dispersion, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method
Grant 8,470,195 - Kunitani , et al. June 25, 2
2013-06-25
Aqueous Dispersion For Chemical Mechanical Polishing, Chemical Mechanical Polishing Method, Kit For Chemical Mechanical Polishing, And Kit For Preparing Aqueous Dispersion For Chemical Mechanical Polishing
App 20110250756 - UCHIKURA; Kazuhito ;   et al.
2011-10-13
Aqueous Dispersion For Chemical Mechanical Polishing And Chemical Mechanical Polishing Method
App 20110081780 - Shida; Hirotaka ;   et al.
2011-04-07
Aqueous Dispersion For Chemical Mechanical Polishing And Chemical Mechanical Polishing Method
App 20110053462 - Shida; Hirotaka ;   et al.
2011-03-03
Aqueous Dispersion For Chemical Mechanical Polishing, Chemical Mechanical Polishing Method, Kit For Chemical Mechanical Polishing, And Kit For Preparing Aqueous Dispersion For Chemical Mechanical Polishing
App 20090124172 - Uchikura; Kazuhito ;   et al.
2009-05-14
Chemical Mechanical Polishing Aqueous Dispersion Preparation Set, Method Of Preparing Chemical Mechanical Polishing Aqueous Dispersion, Chemical Mechanical Polishing Aqueous Dispersion, And Chemical Mechanical Polishing Method
App 20080318427 - KUNITANI; Eiichirou ;   et al.
2008-12-25
Cleaning Composition, Cleaning Method, And Manufacturing Method Of Semiconductor Device
App 20080045016 - Andou; Michiaki ;   et al.
2008-02-21
Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
App 20060276041 - Uchikura; Kazuhito ;   et al.
2006-12-07
Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
App 20060201914 - Uchikura; Kazuhito ;   et al.
2006-09-14
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
Grant 6,935,928 - Uchikura , et al. August 30, 2
2005-08-30
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
App 20050037693 - Uchikura, Kazuhito ;   et al.
2005-02-17
Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process
App 20010008828 - Uchikura, Kazuhito ;   et al.
2001-07-19

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