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Patent applications and USPTO patent grants for Uchigasaki; Isao.The latest application filed is for "moistureproof insulating coating composition for packing circuit boards".
Patent | Date |
---|---|
Moistureproof insulating coating composition for packing circuit boards Grant 4,490,496 - Maekawa , et al. December 25, 1 | 1984-12-25 |
Heat resistant resin and process for producing the same Grant 4,448,844 - Osada , et al. May 15, 1 | 1984-05-15 |
Process for producing flyback transformer Grant 4,309,519 - Obara , et al. January 5, 1 | 1982-01-05 |
Resin composition with low shrinkage Grant 4,233,413 - Monma , et al. November 11, 1 | 1980-11-11 |
Resin composition having low shrink properties Grant 4,228,251 - Maekawa , et al. October 14, 1 | 1980-10-14 |
Resinous composition Grant 4,224,430 - Maekawa , et al. September 23, 1 | 1980-09-23 |
Resinous composition Grant 4,100,120 - Maekawa , et al. July 11, 1 | 1978-07-11 |
Method for conducting a vapor-liquid contact reaction semi-batchwise Grant 4,064,111 - Masuda , et al. December 20, 1 | 1977-12-20 |
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