Uchida; Yasufumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Uchida; Yasufumi.The latest application filed is for "oxygen detection method, air leakage determination method, gas component detection device, and vacuum processing apparatus".

Company Profile

1.12.13

Uchida; Yasufumi - Chigasaki JP
Uchida; Yasufumi - Chigasaki-shi JP
Uchida; Yasufumi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Oxygen detection method, air leakage determination method, gas component detection device, and vacuum processing apparatus Grant 8,288,715 - Nakajima , et al. October 16, 2	2012-10-16
Oxygen Detection Method, Air Leakage Determination Method, Gas Component Detection Device, And Vacuum Processing Apparatus App 20110315872 - Nakajima; Toyoaki ; et al.	2011-12-29
Junction member comprising junction pads arranged in matrix and multichip package using same Grant 8,044,518 - Uchida October 25, 2	2011-10-25
Rearrangement sheet, semiconductor device and method of manufacturing thereof App 20090031563 - Uchida; Yasufumi ; et al.	2009-02-05
Rearrangement sheet, semiconductor device and method of manufacturing thereof Grant 7,435,626 - Uchida , et al. October 14, 2	2008-10-14
Semiconductor device and manufacturing method thereof Grant 7,317,244 - Uchida , et al. January 8, 2	2008-01-08
Junction member and multichip package using same App 20050161792 - Uchida, Yasufumi	2005-07-28
Rearrangemet sheet, semiconductor device and method of manufacturing thereof App 20040232539 - Uchida, Yasufumi ; et al.	2004-11-25
Multi-chip package semiconductor device having plural level interconnections Grant 6,812,556 - Uchida November 2, 2	2004-11-02
Rearrangement sheet, semiconductor device and method of manufacturing thereof Grant 6,787,915 - Uchida , et al. September 7, 2	2004-09-07
Semiconductor device having multi-chip package Grant 6,690,089 - Uchida February 10, 2	2004-02-10
Method for fabricating multi-chip package semiconductor device Grant 6,686,223 - Uchida February 3, 2	2004-02-03
Semiconductor Device Having Multi-chip Package App 20030214023 - Uchida, Yasufumi	2003-11-20
Method For Fabricating Multi-chip Package Semiconductor Device App 20030211656 - Uchida, Yasufumi	2003-11-13
Semiconductor device App 20030189258 - Uchida, Yasufumi	2003-10-09
Method for selectively providing adhesive on a semiconductor device Grant 6,620,649 - Uchida September 16, 2	2003-09-16
Semiconductor device with shock absorbing bond pad Grant 6,614,112 - Uchida September 2, 2	2003-09-02
Semiconductor device and manufacturing method thereof App 20030132516 - Uchida, Yasufumi ; et al.	2003-07-17
Semiconductor Device And Method For Fabricating The Same App 20030052412 - Uchida, Yasufumi	2003-03-20
Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the same App 20020195692 - Yamada, Shigeru ; et al.	2002-12-26
Semiconductor device and method for fabricating the same App 20020180058 - Uchida, Yasufumi	2002-12-05
Method for fabricating semiconductor device App 20020155638 - Uchida, Yasufumi	2002-10-24
Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor Grant 6,459,145 - Yamada , et al. October 1, 2	2002-10-01
Rearrangement sheet, semiconductor device and method of manufacturing thereof App 20020121686 - Uchida, Yasufumi ; et al.	2002-09-05
Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same Grant 6,177,725 - Yamada , et al. January 23, 2	2001-01-23

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