Uchida; Masato
Patent Applications and Registrations
Patent applications and USPTO patent grants for Uchida; Masato.The latest application filed is for "semiconductor device with thermally compensating sio.sub.2 -silicate glass-sic passivation layer".
- Uchida; Masato - Yokohama JP
| Patent | Date |
|---|---|
| Semiconductor device with thermally compensating SiO.sub.2 -silicate glass-SiC passivation layer Grant 4,224,636 - Yonezawa , et al. September 23, 1 | 1980-09-23 |
| Semiconductor device with silicon carbide-glass-silicon carbide passivating overcoat Grant 4,161,743 - Yonezawa , et al. July 17, 1 | 1979-07-17 |
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