Uchida; Hideo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Uchida; Hideo.The latest application filed is for "attachment structure for clip".
- Uchida; Hideo - Soka JP
- UCHIDA; Hideo - Soka-shi Saitama
- Uchida; Hideo - Tokyo JP
- Uchida; Hideo - Amagasaki JP
- Uchida, Hideo - Hyogo JP
| Patent | Date |
|---|---|
| Attachment structure for clip Grant 9,784,294 - Uchida , et al. October 10, 2 | 2017-10-10 |
| Attachment Structure For Clip App 20160010674 - UCHIDA; Hideo ; et al. | 2016-01-14 |
| Ballpoint pen Grant D594,060 - Uchida , et al. June 9, 2 | 2009-06-09 |
| Lead frame and a resin-sealed semiconductor device exhibiting improved resin balance, and a method for manufacturing the same Grant 6,828,661 - Araki , et al. December 7, 2 | 2004-12-07 |
| Lead frame, resin-sealed semiconductor device, and method for fabricating the same App 20030001244 - Araki, Masanao ; et al. | 2003-01-02 |
| Method of enhancing transfer printing quality Grant 6,386,698 - Suga , et al. May 14, 2 | 2002-05-14 |
| Method of enhancing transfer printing quality App 20020008748 - Suga, Shoji ; et al. | 2002-01-24 |
| Image processor Grant 4,586,089 - Nakazato , et al. April 29, 1 | 1986-04-29 |
| Method and apparatus for processing video signals Grant 4,538,184 - Otsuka , et al. August 27, 1 | 1985-08-27 |
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