Tzu; Chung Hsing
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tzu; Chung Hsing.The latest application filed is for "multi-sided cooling semiconductor package and method of manufacturing the same".
Company Profile
0.14.36
- Tzu; Chung Hsing - Hsinchu TW
- Tzu; Chung Hsing - Hsinchu City TW
- Tzu; Chung Hsing - Taipei TW
- TZU; Chung Hsing - Taipei County TW
- Tzu; Chung Hsing - Taiei County TW
- Tzu; Chung Hsing - ChungHe City TW
- Tzu; Chung-Hsing - Taipei Hsien TW
- Tzu; Chung-Hsing - Zhonghe TW
- Tzu; Chung-Hsing - Zhonghe City TW
- Tzu; Chung-Hsing - Zhong-he TW
- Tzu; Chung-Hsing - Zhanghe City TW
- Tzu; Chung-Hsing - Taoyuan Hsien TW
- Tzu; Chung-Hsing - Chung-Ho TW
Patent Activity
| Patent | Date |
|---|---|
| Multi-sided cooling semiconductor package and method of manufacturing the same Grant 11,380,646 - Tzu July 5, 2 | 2022-07-05 |
| Multi-sided Cooling Semiconductor Package And Method Of Manufacturing The Same App 20210358876 - Tzu; Chung Hsing | 2021-11-18 |
| Direct Cooling Power Semiconductor Package App 20210358833 - Tzu; Chung Hsing ; et al. | 2021-11-18 |
| Field-effect transistor structure for preventing from shorting Grant 9,520,343 - Tzu December 13, 2 | 2016-12-13 |
| Field-effect Transistor Structure For Preventing From Shorting App 20160358844 - TZU; Chung Hsing | 2016-12-08 |
| High Heat-dissipation Chip Package Structure App 20160329270 - TZU; Chung Hsing | 2016-11-10 |
| High heat-dissipation chip package structure Grant 9,472,493 - Tzu October 18, 2 | 2016-10-18 |
| Semiconductor Transistor Package Structure App 20160284634 - TZU; Chung Hsing | 2016-09-29 |
| Intelligent Power Module Process App 20150195919 - TZU; Chung Hsing | 2015-07-09 |
| Molded can package App 20130070424 - TZU; Chung Hsing | 2013-03-21 |
| Pre molded can package App 20130070427 - TZU; Chung Hsing | 2013-03-21 |
| Chip Package App 20120103668 - TZU; Chung Hsing | 2012-05-03 |
| Muti Thickness Lead Frame App 20110127658 - Tzu; Chung Hsing | 2011-06-02 |
| Connection Device Bewteen Transistor And Lead Frame App 20110049692 - TZU; Chung Hsing | 2011-03-03 |
| Flip-chip Package Structure With Block Bumps And The Wedge Bonding Method Thereof App 20110031302 - TZU; CHUNG HSING | 2011-02-10 |
| Wire bonding structure and manufacturing method thereof Grant 7,859,123 - Tzu December 28, 2 | 2010-12-28 |
| Flip-chip package structure and the die attach method thereof App 20100133671 - Tzu; Chung Hsing | 2010-06-03 |
| Semiconductor device and manufacturing method thereof App 20100133668 - Tzu; Chung Hsing | 2010-06-03 |
| Flip-chip Chip-scale Package Structure App 20100123243 - TZU; CHUNG HSING | 2010-05-20 |
| Flip-chip Package Structure With Block Bumps And The Wedge Bonding Method Thereof App 20100102429 - TZU; CHUNG HSING | 2010-04-29 |
| Wire Bonding Structure And Manufacturing Method Thereof App 20100072619 - Tzu; Chung Hsing | 2010-03-25 |
| Touch Screen App 20090109194 - Weng; Wen-Pin ; et al. | 2009-04-30 |
| Enhanced durability multimedia card App 20080169541 - Miks; Jeffrey Alan ; et al. | 2008-07-17 |
| Chip packaging structure without leadframe Grant 7,274,098 - Tzu September 25, 2 | 2007-09-25 |
| Chip packaging structure without leadframe App 20070145605 - Tzu; Chung-Hsing | 2007-06-28 |
| Electrical-interference-isolated transistor structure Grant 7,187,064 - Tzu , et al. March 6, 2 | 2007-03-06 |
| Chip packaging structure without leadframe App 20070029680 - Tzu; Chung-Hsing | 2007-02-08 |
| Memory module with chip hold-down fixture App 20070020964 - Tzu; Chung-Hsing | 2007-01-25 |
| Chip packaging structure adapted to reduce electromagnetic interference Grant 7,119,420 - Tzu October 10, 2 | 2006-10-10 |
| Chip packaging structure adapted to reduce electromagnetic interference App 20060170082 - Tzu; Chung-Hsing | 2006-08-03 |
| Memory card with memory chip replaceable App 20060171126 - Tzu; Chung-Hsing | 2006-08-03 |
| Stack chip package App 20060138628 - Tzu; Chung-Hsing | 2006-06-29 |
| Packaged Chip Capable Of Lowering Characteristic Impedance App 20060131742 - Tzu; Chung-Hsing | 2006-06-22 |
| Electrical-interference-isolated transistor structure App 20060125063 - Tzu; Chung-Hsing | 2006-06-15 |
| IC with stably mounted chip App 20060017146 - Tzu; Chung-Hsing ; et al. | 2006-01-26 |
| Semiconductor package for efficient heat spreading Grant 6,963,141 - Lee , et al. November 8, 2 | 2005-11-08 |
| Reinforced die pad support structure Grant 6,921,967 - Tzu , et al. July 26, 2 | 2005-07-26 |
| Reinforced Die Pad Support Structure App 20050062139 - Tzu, Chung-Hsing ; et al. | 2005-03-24 |
| Structure of heat slug-equipped packages and the packaging method of the same App 20010019181 - Lee, Jung-Yu ; et al. | 2001-09-06 |
| Semiconductor package with an improved leadframe Grant 6,211,563 - Tzu April 3, 2 | 2001-04-03 |
| Semiconductor package having multi-dies Grant 6,201,302 - Tzu March 13, 2 | 2001-03-13 |
| Universal leadframe for semiconductor devices Grant 6,101,101 - Tzu , et al. August 8, 2 | 2000-08-08 |
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