Tzeng; Kuo-Hwa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tzeng; Kuo-Hwa.The latest application filed is for "method for forming thin semiconductor-on-insulator (soi) substrates".

Company Profile

11.21.21

Tzeng; Kuo-Hwa - Taipei City TW
Tzeng; Kuo-Hwa - Taipei TW
Tzeng; Kuo-Hwa - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Forming Thin Semiconductor-on-insulator (soi) Substrates App 20220238662 - Wu; Cheng-Ta ; et al.	2022-07-28
Back-side Deep Trench Isolation Structure For Image Sensor App 20220102397 - Wu; Cheng-Ta ; et al.	2022-03-31
Method for forming thin semiconductor-on-insulator (SOI) substrates Grant 11,264,469 - Wu , et al. March 1, 2	2022-03-01
Method For Manufacturing Semiconductor Device And Manufacturing Method Of The Same App 20210358740 - LIN; YUNG-LUNG ; et al.	2021-11-18
SOI substrate, semiconductor device and method for manufacturing the same Grant 11,164,945 - Wu , et al. November 2, 2	2021-11-02
Method for manufacturing semiconductor device and manufacturing method of the same Grant 11,087,971 - Lin , et al. August 10, 2	2021-08-10
Semiconductor device structure having carrier-trapping layers with different grain sizes Grant 11,063,117 - Cheng , et al. July 13, 2	2021-07-13
Method For Forming Thin Semiconductor-on-insulator (soi) Substrates App 20200258989 - A1	2020-08-13
Method for forming thin semiconductor-on-insulator (SOI) substrates Grant 10,658,474 - Wu , et al.	2020-05-19
Method For Manufacturing Semiconductor Device And Manufacturing Method Of The Same App 20200083036 - LIN; YUNG-LUNG ; et al.	2020-03-12
Method For Forming Thin Semiconductor-on-insulator (soi) Substrates App 20200058746 - Wu; Cheng-Ta ; et al.	2020-02-20
Soi Substrate, Semiconductor Device And Method For Manufacturing The Same App 20200058737 - WU; CHENG-TA ; et al.	2020-02-20
Method for manufacturing semiconductor device and manufacturing method of the same Grant 10,504,716 - Lin , et al. Dec	2019-12-10
SOI substrate, semiconductor device and method for manufacturing the same Grant 10,468,486 - Wu , et al. No	2019-11-05
Method For Manufacturing Semiconductor Device And Manufacturing Method Of The Same App 20190287788 - LIN; YUNG-LUNG ; et al.	2019-09-19
Soi Substrate, Semiconductor Device And Method For Manufacturing The Same App 20190131400 - WU; CHENG-TA ; et al.	2019-05-02
Method for forming trench liner passivation Grant 10,204,822 - Chou , et al. Feb	2019-02-12
Structure And Formation Method Of Semiconductor Device Structure App 20180308928 - CHENG; Yu-Hung ; et al.	2018-10-25
Method For Forming Trench Liner Passivation App 20180174888 - CHOU; Cheng-Hsien ; et al.	2018-06-21
Trench liner passivation for dark current improvement Grant 9,917,003 - Chou , et al. March 13, 2	2018-03-13
High dielectric constant structure for the vertical transfer gates of a complementary metal-oxide semiconductor (CMOS) image sensor Grant 9,281,331 - Chen , et al. March 8, 2	2016-03-08
Method for forming interconnect structures Grant 9,245,792 - Chen , et al. January 26, 2	2016-01-26
High Dielectric Constant Structure For The Vertical Transfer Gates Of A Complementary Metal-oxide Semiconductor (cmos) Image Sensor App 20150372034 - Chen; Sheng-Chau ; et al.	2015-12-24
Selective etch-back process for semiconductor devices Grant 9,159,808 - Chen , et al. October 13, 2	2015-10-13
Trench Liner Passivation for Dark Current Improvement App 20150001669 - Chou; Cheng-Hsien ; et al.	2015-01-01
Hybrid gap-fill approach for STI formation Grant 8,546,242 - Chen , et al. October 1, 2	2013-10-01
Hybrid STI gap-filling approach Grant 8,319,311 - Chen , et al. November 27, 2	2012-11-27
Hybrid Gap-fill Approach for STI Formation App 20120235273 - Chen; Neng-Kuo ; et al.	2012-09-20
Hybrid gap-fill approach for STI formation Grant 8,187,948 - Chen , et al. May 29, 2	2012-05-29
Method of forming shallow trench isolation structure Grant 8,173,516 - Chen , et al. May 8, 2	2012-05-08
Method Of Forming Shallow Trench Isolation Structure App 20110195559 - Chen; Neng-Kuo ; et al.	2011-08-11
Shallow trench isolation corner rounding Grant 7,892,929 - Chen , et al. February 22, 2	2011-02-22
Hybrid STI Gap-Filling Approach App 20100230757 - Chen; Neng-Kuo ; et al.	2010-09-16
Selective Etch-Back Process for Semiconductor Devices App 20100190345 - Chen; Neng-Kuo ; et al.	2010-07-29
STI film property using SOD post-treatment Grant 7,655,532 - Chen , et al. February 2, 2	2010-02-02
Method for Forming Interconnect Structures App 20100022084 - Chen; Neng-Kuo ; et al.	2010-01-28
Sti Film Property Using Sod Post-treatment App 20100022068 - Chen; Neng-Kuo ; et al.	2010-01-28
Shallow Trench Isolation Corner Rounding App 20100015776 - Chen; Neng-Kuo ; et al.	2010-01-21
Hybrid Gap-fill Approach for STI Formation App 20090209083 - Chen; Neng-Kuo ; et al.	2009-08-20

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