Tzeng; Chih-Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tzeng; Chih-Ming.The latest application filed is for "semiconductor package structure".
- Tzeng; Chih-Ming - Hsinchu TW
- TZENG; Chih-Ming - Hsinchu City TW
- Tzeng; Chih-Ming - Fengshan TW
- Tzeng; Chih-Ming - Fengshan City TW
| Patent | Date |
|---|---|
| Semiconductor package structure Grant 10,672,677 - Chang , et al. | 2020-06-02 |
| Intelligent diagnosis system for power module and method thereof Grant 10,288,696 - Chiu , et al. | 2019-05-14 |
| Semiconductor Package Structure App 20180261519 - CHANG; Jing-Yao ; et al. | 2018-09-13 |
| Intelligent Diagnosis System For Power Module And Method Thereof App 20180136287 - CHIU; Chih-Chung ; et al. | 2018-05-17 |
| Semiconductor Package Structure App 20170084521 - CHANG; Jing-Yao ; et al. | 2017-03-23 |
| Electrically stackable semiconductor wafer and chip packages Grant 9,601,474 - Chen , et al. March 21, 2 | 2017-03-21 |
| Wafer Leveled Chip Packaging Structure and Method Thereof App 20150364457 - Chen; Shou-Lung ; et al. | 2015-12-17 |
| Wafer leveled chip packaging structure and method thereof Grant 9,059,181 - Chen , et al. June 16, 2 | 2015-06-16 |
| Wafer Leveled Chip Packaging Structure and Method Thereof App 20140217587 - Chen; Shou-Lung ; et al. | 2014-08-07 |
| Wafer-leveled chip packaging structure and method thereof Grant 8,587,091 - Chen , et al. November 19, 2 | 2013-11-19 |
| Semiconductor package device Grant 8,314,482 - Chen , et al. November 20, 2 | 2012-11-20 |
| Wafer-leveled Chip Packaging Structure And Method Thereof App 20120267765 - CHEN; Shou-Lung ; et al. | 2012-10-25 |
| Wafer-leveled chip packaging structure and method thereof Grant 7,528,009 - Chen , et al. May 5, 2 | 2009-05-05 |
| Wafer-leveled chip packaging structure and method thereof App 20080029870 - Chen; Shou-Lung ; et al. | 2008-02-07 |
| Wafer-leveled chip packaging structure and method thereof Grant 7,294,920 - Chen , et al. November 13, 2 | 2007-11-13 |
| Wafer-leveled chip packaging structure and method thereof App 20070197018 - Chen; Shou-Lung ; et al. | 2007-08-23 |
| Wafer-leveled chip packaging structure and method thereof App 20060019484 - Chen; Shou-Lung ; et al. | 2006-01-26 |
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