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Patent applications and USPTO patent grants for Tyra; Joe B..The latest application filed is for "externally connected thin electronic circuit having recessed bonding pads".
Patent | Date |
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Externally connected thin electronic circuit having recessed bonding pads Grant 5,731,222 - Malloy , et al. March 24, 1 | 1998-03-24 |
Apparatus and method for protecting metal bumped integrated circuit chips during processing and for providing mechanical support to interconnected chips Grant 5,523,628 - Williams , et al. June 4, 1 | 1996-06-04 |
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