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Toughness, adhesion and smooth metal lines of porous low K dielectric interconnect structures
Grant RE45,781 - Hedrick , et al. October 27, 2 | 2015-10-27 |
Beol Compatible Fet Structure
App 20150060856 - TYBERG; Christy S. ; et al. | 2015-03-05 |
BEOL compatible FET structrure
Grant 8,569,803 - Tyberg , et al. October 29, 2 | 2013-10-29 |
Mechanically robust metal/low-k interconnects
Grant 8,445,377 - Lin , et al. May 21, 2 | 2013-05-21 |
BEOL compatible FET structure
Grant 8,441,042 - Tyberg , et al. May 14, 2 | 2013-05-14 |
Beol Compatible Fet Structrure
App 20120305929 - Tyberg; Christy S. ; et al. | 2012-12-06 |
Reprogrammable fuse structure and method
Grant 8,278,155 - Burr , et al. October 2, 2 | 2012-10-02 |
MECHANICALLY ROBUST METAL/LOW-k INTERCONNECTS
App 20110318942 - Lin; Qinghuang ; et al. | 2011-12-29 |
Mechanically robust metal/low-.kappa. interconnects
Grant 8,017,522 - Lin , et al. September 13, 2 | 2011-09-13 |
Reprogrammable Fuse Structure and Method
App 20110207286 - Burr; Geoffrey W. ; et al. | 2011-08-25 |
Reprogrammable fuse structure and method
Grant 7,960,808 - Burr , et al. June 14, 2 | 2011-06-14 |
Polycarbosilane buried etch stops in interconnect structures
Grant 7,879,717 - Huang , et al. February 1, 2 | 2011-02-01 |
Method and apparatus for fabricating sub-lithography data tracks for use in magnetic shift register memory devices
Grant 7,755,921 - Assefa , et al. July 13, 2 | 2010-07-13 |
Dual damascene integration of ultra low dielectric constant porous materials
Grant 7,737,561 - Kumar , et al. June 15, 2 | 2010-06-15 |
Beol Compatible Fet Structure
App 20100006850 - Tyberg; Christy S. ; et al. | 2010-01-14 |
MECHANICALLY ROBUST METAL/LOW-k INTERCONNECTS
App 20090294925 - Lin; Qinghuang ; et al. | 2009-12-03 |
Method to remove beol sacrificial materials and chemical residues by irradiation
Grant 7,598,169 - Lin , et al. October 6, 2 | 2009-10-06 |
Method And Apparatus For Fabricating Sub-lithography Data Tracks For Use In Magnetic Shift Register Memory Devices
App 20090046493 - ASSEFA; SOLOMON ; et al. | 2009-02-19 |
Heat-shielded low power PCM-based reprogrammable eFUSE device
Grant 7,491,965 - Doyle , et al. February 17, 2 | 2009-02-17 |
Polycarbosilane Buried Etch Stops In Interconnect Structures
App 20080254612 - Huang; Elbert E. ; et al. | 2008-10-16 |
Heat-shielded Low Power Pcm-based Reprogrammable Efuse Device
App 20080224118 - Doyle; James P. ; et al. | 2008-09-18 |
Method To Remove Beol Sacrificial Materials And Chemical Residues By Irradiation
App 20080200034 - Lin; Qinghuang ; et al. | 2008-08-21 |
Chemical planarization performance for copper/low-k interconnect structures
Grant 7,407,879 - Nicholson , et al. August 5, 2 | 2008-08-05 |
MECHANICALLY ROBUST METAL/LOW-k INTERCONNECTS
App 20080173984 - Lin; Qinghuang ; et al. | 2008-07-24 |
Polycarbosilane buried etch stops in interconnect structures
Grant 7,396,758 - Huang , et al. July 8, 2 | 2008-07-08 |
Heat-shielded low power PCM-based reprogrammable EFUSE device
Grant 7,394,089 - Doyle , et al. July 1, 2 | 2008-07-01 |
Reprogrammable fuse structure and method
Grant 7,388,273 - Burr , et al. June 17, 2 | 2008-06-17 |
Mosfet Structure With Ultra-low K Spacer
App 20080128766 - Huang; Elbert E. ; et al. | 2008-06-05 |
Dual Damascene Integration Of Ultra Low Dielectric Constant Porous Materials
App 20080099923 - Kumar; Kaushik A. ; et al. | 2008-05-01 |
MOSFET structure with ultra-low K spacer
Grant 7,365,378 - Huang , et al. April 29, 2 | 2008-04-29 |
Method for dual damascene integration of ultra low dielectric constant porous materials
Grant 7,338,895 - Kumar , et al. March 4, 2 | 2008-03-04 |
Heat-shielded Low Power Pcm-based Reprogrammable Efuse Device
App 20080048169 - Doyle; James P. ; et al. | 2008-02-28 |
Low dielectric semiconductor device and process for fabricating the same
Grant 7,329,600 - Clevenger , et al. February 12, 2 | 2008-02-12 |
Reprogrammable Fuse Structure and Method
App 20070290233 - Burr; Geoffrey W. ; et al. | 2007-12-20 |
BEOL compatible FET structure
App 20070194450 - Tyberg; Christy S. ; et al. | 2007-08-23 |
Polycarbosilane Buried Etch Stops In Interconnect Structures
App 20070111509 - Huang; Elbert E. ; et al. | 2007-05-17 |
Polycarbosilane buried etch stops in interconnect structures
Grant 7,187,081 - Huang , et al. March 6, 2 | 2007-03-06 |
Reprogrammable fuse structure and method
App 20060278895 - Burr; Geoffrey W. ; et al. | 2006-12-14 |
MOSFET structure with ultra-low K spacer
App 20060220152 - Huang; Elbert E. ; et al. | 2006-10-05 |
Chemical planarization performance for copper/low-k interconnect structures
App 20060166012 - Nicholson; Lee M. ; et al. | 2006-07-27 |
Chemical planarization performance for copper/low-k interconnect structures
Grant 7,071,539 - Nicholson , et al. July 4, 2 | 2006-07-04 |
Dual damascene integration of ultra low dielectric constant porous materials
App 20060118961 - Kumar; Kaushik A. ; et al. | 2006-06-08 |
Dual damascene integration of ultra low dielectric constant porous materials
Grant 7,057,287 - Kumar , et al. June 6, 2 | 2006-06-06 |
Single and multilevel rework
Grant 6,982,227 - Cooney, III , et al. January 3, 2 | 2006-01-03 |
Low dielectric semiconductor device and process for fabricating the same
App 20050227480 - Clevenger, Lawrence ; et al. | 2005-10-13 |
Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens
Grant 6,933,586 - Fornof , et al. August 23, 2 | 2005-08-23 |
Method for reworking low-k polymers used in semiconductor structures
Grant 6,864,180 - Restaino , et al. March 8, 2 | 2005-03-08 |
Dual damascene integration of ultra low dielectric constant porous materials
App 20050040532 - Kumar, Kaushik A. ; et al. | 2005-02-24 |
Chemical planarization performance for copper/low-k interconnect structures
App 20050023689 - Nicholson, Lee M. ; et al. | 2005-02-03 |
Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens
Grant 6,844,257 - Fornof , et al. January 18, 2 | 2005-01-18 |
Composition and method to achieve reduced thermal expansion in polyarylene networks
Grant 6,818,285 - Hedrick , et al. November 16, 2 | 2004-11-16 |
Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures
Grant 6,783,862 - Hedrick , et al. August 31, 2 | 2004-08-31 |
Polycarbosilane buried etch stops in interconnect structures
App 20040147111 - Huang, Elbert E. ; et al. | 2004-07-29 |
Single and multilevel rework
App 20040142565 - Cooney, Edward C. III ; et al. | 2004-07-22 |
Improved Formation Of Porous Interconnection Layers
App 20040130027 - Chen, Shyng-Tsong ; et al. | 2004-07-08 |
Composition and method to achieve reduced thermal expansion in polyarylene networks
App 20040126586 - Hedrick, Jeffrey C. ; et al. | 2004-07-01 |
Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens
App 20040018717 - Fornof, Ann R. ; et al. | 2004-01-29 |
Single and multilevel rework
Grant 6,674,168 - Cooney, III , et al. January 6, 2 | 2004-01-06 |
Film planarization for low-k polymers used in semiconductor structures
Grant 6,638,878 - Restaino , et al. October 28, 2 | 2003-10-28 |
Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens
App 20030111263 - Fornof, Ann R. ; et al. | 2003-06-19 |
Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures
App 20030114013 - Hedrick, Jeffrey C. ; et al. | 2003-06-19 |
Method for reworking low-K polymers used in semiconductor structures
App 20030062336 - Restaino, Darryl D. ; et al. | 2003-04-03 |
Film planarization for low-k polymers used in semiconductor structures
App 20030064605 - Restaino, Darryl D. ; et al. | 2003-04-03 |
Fiber materials for manufacturing fiber reinforced phenolic composites and adhesives with nucleophilic initiators positioned on the fiber surfaces
Grant 6,090,486 - Riffle , et al. July 18, 2 | 2000-07-18 |
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