| Patent | Date |
|---|
Method Of Monitoring Tool
App 20220130697 - LIN; Hom-Chung ; et al. | 2022-04-28 |
Tool monitoring device and method of monitoring tool
Grant 11,239,099 - Lin , et al. February 1, 2 | 2022-02-01 |
Gas Delivery System For Ion Implanter
App 20210366690 - LIN; Hom-Chung ; et al. | 2021-11-25 |
Fault detection method in semiconductor fabrication facility
Grant 11,056,365 - Lin , et al. July 6, 2 | 2021-07-06 |
Method for controlling temperature of furnace in semiconductor fabrication process
Grant 10,930,527 - Lo , et al. February 23, 2 | 2021-02-23 |
Method For Controlling Temperature Of Furnace In Semiconductor Fabrication Process
App 20200312685 - LO; Jian-Lun ; et al. | 2020-10-01 |
Method for controlling temperature of furnace in semiconductor fabrication process
Grant 10,741,426 - Lo , et al. A | 2020-08-11 |
Tool Monitoring Device And Method Of Monitoring Tool
App 20200105555 - LIN; Hom-Chung ; et al. | 2020-04-02 |
Fault Detection Method In Semiconductor Fabrication Facility
App 20190096723 - LIN; Hom-Chung ; et al. | 2019-03-28 |
Method For Controlling Temperature Of Furnace In Semiconductor Fabrication Process
App 20190096714 - LO; Jian-Lun ; et al. | 2019-03-28 |
Method of monitoring high tilt angle of medium current implant
Grant 6,924,215 - Huang , et al. August 2, 2 | 2005-08-02 |
Method for forming a high quality chemical oxide on a freshly cleaned silicon surface as a native oxide replacement
Grant 6,878,578 - Twu , et al. April 12, 2 | 2005-04-12 |
Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using
Grant 6,837,774 - Hu , et al. January 4, 2 | 2005-01-04 |
Metrology for monitoring a rapid thermal annealing process
Grant 6,777,251 - Lu , et al. August 17, 2 | 2004-08-17 |
Multilayer interface in copper CMP for low K dielectric
Grant 6,753,249 - Chen , et al. June 22, 2 | 2004-06-22 |
Ventilated platen/polishing pad assembly for chemcial mechanical polishing and method of using
Grant 6,722,949 - Hu , et al. April 20, 2 | 2004-04-20 |
Formation of dual gate oxide by two-step wet oxidation
Grant 6,706,577 - Twu , et al. March 16, 2 | 2004-03-16 |
Partitioned wafer boat for constant wafer backside emmissivity
App 20040043617 - You, Wei-Ming ; et al. | 2004-03-04 |
Metrology for monitoring a rapid thermal annealing process
App 20030235928 - Lu, Ching Shan ; et al. | 2003-12-25 |
Apparatus and method for improving scrubber cleaning
App 20030230323 - You, Wei-Ming ; et al. | 2003-12-18 |
Method of monitoring high tilt angle of medium current implant
App 20030224541 - Huang, Hung-Ta ; et al. | 2003-12-04 |
Electrostatic charge-free solvent-type dryer for semiconductor wafers
Grant 6,647,998 - Twu , et al. November 18, 2 | 2003-11-18 |
A Method For High Temperature Oxide Layer Anneal To Prevent Oxide Edge Peeling
App 20030207591 - Lu, Ching-Shan ; et al. | 2003-11-06 |
Use of low-high slurry flow to eliminate copper line damages
App 20030207582 - Twu, Jih-Churng ; et al. | 2003-11-06 |
Method for high temperature oxidations to prevent oxide edge peeling
Grant 6,642,128 - Lu , et al. November 4, 2 | 2003-11-04 |
Reduction of Cu line damage by two-step CMP
Grant 6,620,725 - Shue , et al. September 16, 2 | 2003-09-16 |
Electrostatic charge-free solvent-type dryer for semiconductor wafers
App 20020195130 - Twu, Jih-Churng ; et al. | 2002-12-26 |
Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using
App 20020142704 - Hu, Tien-Chen ; et al. | 2002-10-03 |
Ventilated platen/polishing pad assembly for chemical mechanical polishing and method of using
App 20020137435 - Hu, Tien-Chen ; et al. | 2002-09-26 |
Elimination of electrochemical deposition copper line damage for damascene processing
Grant 6,429,118 - Chen , et al. August 6, 2 | 2002-08-06 |
Apparatus and method for wet cleaning wafers without ammonia vapor damage
App 20020092546 - Twu, Jih-Churng ; et al. | 2002-07-18 |
Underlayer liner for copper damascene in low k dielectric
Grant 6,417,106 - Twu , et al. July 9, 2 | 2002-07-09 |
Method for cleaning semiconductor wafers with ozone-containing solvent
App 20020062841 - Twu, Jih-Churng ; et al. | 2002-05-30 |
Method to prevent copper CMP dishing
Grant 6,391,780 - Shih , et al. May 21, 2 | 2002-05-21 |
Lightly nitridation surface for preparing thin-gate oxides
Grant 6,380,056 - Shue , et al. April 30, 2 | 2002-04-30 |
Way to remove CU line damage after CU CMP
Grant 6,358,119 - Shih , et al. March 19, 2 | 2002-03-19 |
Method to reduce the damages of copper lines
App 20010027010 - Jang, Syun-Ming ; et al. | 2001-10-04 |
Use of PE-SiON or PE-OXIDE for contact or via photo and for defect reduction with oxide and W chemical-mechanical polish
Grant 6,228,760 - Yu , et al. May 8, 2 | 2001-05-08 |
Apparatus and method for chemical mechanical polishing metal on a semiconductor wafer
Grant 6,227,947 - Hu , et al. May 8, 2 | 2001-05-08 |
Lightly nitridation surface for preparing thin-gate oxides
Grant 6,197,701 - Shue , et al. March 6, 2 | 2001-03-06 |
Reduction of surface defects on amorphous silicon grown by a low-temperature, high pressure LPCVD process
Grant 6,197,669 - Twu , et al. March 6, 2 | 2001-03-06 |
Amorphous silicon gate with mismatched grain-boundary microstructure
Grant 6,162,716 - Yu , et al. December 19, 2 | 2000-12-19 |
Method for forming a self-aligned copper structure with improved planarity
Grant 6,080,656 - Shih , et al. June 27, 2 | 2000-06-27 |
| 