| Patent | Date |
|---|
Integrated Circuit Testing Device With Coupled Control Of Thermal System
App 20220206060 - TUSTANIWSKYJ; Jerry Ihor | 2022-06-30 |
Assembly and sub-assembly for thermal control of electronic devices
Grant 11,039,528 - Tustaniwskyj , et al. June 15, 2 | 2021-06-15 |
Alignment Mechanism
App 20210088579 - TUSTANIWSKYJ; Jerry Ihor ; et al. | 2021-03-25 |
Socket Side Thermal System
App 20210063436 - TUSTANIWSKYJ; Jerry Ihor | 2021-03-04 |
Socket side thermal system
Grant 10,782,316 - Tustaniwskyj Sept | 2020-09-22 |
Leak tolerant liquid cooling system employing improved air purging mechanism
Grant 10,770,317 - Tustaniwskyj Sep | 2020-09-08 |
Assembly And Sub-assembly For Thermal Control Of Electronic Devices
App 20200060019 - TUSTANIWSKYJ; Jerry Ihor ; et al. | 2020-02-20 |
System And Method For Liquid Nitrogen Recycling
App 20190137040 - TUSTANIWSKYJ; Jerry Ihor | 2019-05-09 |
Active Thermal Control Head Having Actuatable Cold Capacitor
App 20180218926 - Stuckey; Larry ; et al. | 2018-08-02 |
Socket Side Thermal System
App 20180196084 - TUSTANIWSKYJ; Jerry Ihor | 2018-07-12 |
Micro-vision alignment system with guiding rings for IC testing
Grant 9,857,419 - Ding , et al. January 2, 2 | 2018-01-02 |
System and method for accelerating a device
Grant 9,733,151 - Tustaniwskyj , et al. August 15, 2 | 2017-08-15 |
Alignment Mechanism
App 20170067960 - TUSTANIWSKYJ; Jerry Ihor ; et al. | 2017-03-09 |
Continuous Fluidic Thermal Interface Material Dispensing
App 20170027084 - KABBANI; Samer ; et al. | 2017-01-26 |
Leak Tolerant Liquid Cooling System Employing Improved Air Purging Mechanism
App 20160379852 - TUSTANIWSKYJ; Jerry Ihor | 2016-12-29 |
Alignment mechanism
Grant 9,500,701 - Tustaniwskyj , et al. November 22, 2 | 2016-11-22 |
System And Method For Accelerating Device
App 20150300911 - TUSTANIWSKYJ; Jerry Ihor ; et al. | 2015-10-22 |
System and method for accelerating a device
Grant 9,010,188 - Tustaniwskyj , et al. April 21, 2 | 2015-04-21 |
Micro-vision Alignment System With Guiding Rings For Ic Testing
App 20150015286 - DING; Kexiang Ken ; et al. | 2015-01-15 |
Temperature measurement using a diode with saturation current cancellation
Grant 8,628,240 - Tustaniwskyj , et al. January 14, 2 | 2014-01-14 |
System And Method For Accelerating A Device
App 20120103094 - Tustaniwskyj; Jerry Ihor ; et al. | 2012-05-03 |
Alignment Mechanism
App 20110226442 - TUSTANIWSKYJ; Jerry Ihor ; et al. | 2011-09-22 |
Temperature Measurement Using A Diode With Saturation Current Cancellation
App 20110013670 - TUSTANIWSKYJ; Jerry Ihor ; et al. | 2011-01-20 |
Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduits
Grant 7,373,967 - Tustaniwskyj , et al. May 20, 2 | 2008-05-20 |
Dual feedback control system for maintaining the temperature of an IC-chip near a set-point
Grant 7,199,597 - Tustaniwskyj , et al. April 3, 2 | 2007-04-03 |
Dual Feedback Control System For Maintaining The Temperature Of An Ic-chip Near A Set-point
App 20070013394 - Tustaniwskyj; Jerry Ihor ; et al. | 2007-01-18 |
Method of extending the operational period of a heat-exchanger in a chip tester
Grant 7,004,243 - Babcock , et al. February 28, 2 | 2006-02-28 |
Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-module
Grant 6,995,980 - Tustaniwskyj , et al. February 7, 2 | 2006-02-07 |
Chip tester having a heat-exchanger with an extendable period of operation
Grant 6,914,446 - Tustaniwskyj , et al. July 5, 2 | 2005-07-05 |
Method of regulating the temperature of integrated circuit modules, using a heat exchanger with a face of a solid malleable metal and a release agent
Grant 6,822,465 - Babcock , et al. November 23, 2 | 2004-11-23 |
Abrupt power change method of preventing an integrated circuit chip from being thermally destroyed, in a tester, due to a defective pressed joint
Grant 6,809,543 - Tustaniwskyj , et al. October 26, 2 | 2004-10-26 |
Initial contact method of preventing an integrated circuit chip from being thermally destroyed, in a tester, due to a defective pressed joint
Grant 6,774,661 - Tustaniwskyj , et al. August 10, 2 | 2004-08-10 |
Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent
Grant 6,658,736 - Babcock , et al. December 9, 2 | 2003-12-09 |
Planar subassembly for testing IC chips having faces with pressed electrical contacts that carry all power and signals for the chips
Grant 6,522,156 - Tustaniwskyj , et al. February 18, 2 | 2003-02-18 |
Planar subassembly for testing IC chips having faces with pressed electrical contacts that carry all power and signals for the chips
App 20020109519 - Tustaniwskyj, Jerry Ihor ; et al. | 2002-08-15 |
System for regulating the temperature of IC-chips with a fluid which is heated and cooled as a function of the fluid temperatures to and from heat exchangers for the IC-chips
Grant 6,412,551 - Tustaniwskyj , et al. July 2, 2 | 2002-07-02 |
System for regulating the temperature of IC-chips with a fluid whose temperature is controlled quickly by a slow response cooler and a fast response heater
Grant 6,362,944 - Tustaniwskyj , et al. March 26, 2 | 2002-03-26 |
Electromechanical apparatus for testing IC chips using first and second sets of substrates which are pressed together
Grant 6,307,388 - Friedrich , et al. October 23, 2 | 2001-10-23 |
Pivoting springy mechanism that opens and closes pressed electrical contacts with a force which is nearly constant over a range of closed positions
Grant 6,307,391 - Tustaniwskyj , et al. October 23, 2 | 2001-10-23 |
Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules
Grant 6,108,208 - Tustaniwskyj , et al. August 22, 2 | 2000-08-22 |
Electromechanical subassembly including a carrier with springy contacts that exert large and small contact forces
Grant 6,074,219 - Tustaniwskyj , et al. June 13, 2 | 2000-06-13 |
Electromechanical module having a thin springy plate for establishing pressed electrical connections
Grant 6,042,388 - Tustaniwskyj , et al. March 28, 2 | 2000-03-28 |
Integrated circuit module having springy contacts of at least two different types for reduced stress
Grant 5,967,798 - Tustaniwskyj , et al. October 19, 1 | 1999-10-19 |
Method of thermal coupling an electronic device to a heat exchange member while said electronic device is being tested
Grant 5,918,665 - Babcock , et al. July 6, 1 | 1999-07-06 |
Temperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperature
Grant 5,844,208 - Tustaniwskyj , et al. December 1, 1 | 1998-12-01 |
Temperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sink
Grant 5,821,505 - Tustaniwskyj , et al. October 13, 1 | 1998-10-13 |
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