Tustaniwskyj; Jerry I.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tustaniwskyj; Jerry I..The latest application filed is for "electromechanical module with post-solder attachable/removable heat sink frame and low profile".

Company Profile

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Tustaniwskyj; Jerry I. - Mission Viejo CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electromechanical module with post-solder attachable/removable heat sink frame and low profile Grant 5,579,205 - Tustaniwskyj , et al. November 26, 1	1996-11-26
Method of stretching solder joints Grant 5,441,195 - Tustaniwskyj , et al. August 15, 1	1995-08-15
Electro-mechanical assembly of high power and low power IC packages with a shared heat sink Grant 5,424,580 - Tustaniwskyj , et al. June 13, 1	1995-06-13
Electromechanical module with small footprint and post-solder attachable/removable heat sink frame Grant 5,307,239 - McCarty , et al. April 26, 1	1994-04-26
High density chip stack having a zigzag-shaped face which accommodates connections between chips Grant 5,019,943 - Fassbender , et al. May 28, 1	1991-05-28
Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation Grant 4,879,629 - Tustaniwskyj , et al. November 7, 1	1989-11-07
Low stress liquid cooling assembly Grant 4,809,134 - Tustaniwskyj , et al. February 28, 1	1989-02-28
Cavity-up-cavity-down multichip integrated circuit package Grant 4,807,019 - Tustaniwskyj February 21, 1	1989-02-21
Spring loaded module for cooling integrated circuit packages directly with a liquid Grant 4,721,996 - Tustaniwskyj , et al. January 26, 1	1988-01-26
Leak tolerant liquid cooling system Grant 4,698,728 - Tustaniwskyj , et al. October 6, 1	1987-10-06
Method of testing wire bonds for defects using a magnetic field Grant 4,677,370 - Tustaniwskyj , et al. June 30, 1	1987-06-30

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