Turner; Jeffrey I.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Turner; Jeffrey I..The latest application filed is for "electroplating processor with geometric electrolyte flow path".

Company Profile

0.8.8

Turner; Jeffrey I. - Kalispell MT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electroplating Processor With Geometric Electrolyte Flow Path App 20150075976 - Harris; Randy A. ; et al.	2015-03-19
Electroplating processor with geometric electrolyte flow path Grant 8,968,533 - Harris , et al. March 3, 2	2015-03-03
Electroplating Processor With Geometric Electrolyte Flow Path App 20130299343 - Harris; Randy A. ; et al.	2013-11-14
In-situ Cleaning Processes For Semiconductor Electroplating Electrodes App 20070215481 - Graham; Lyndon W. ; et al.	2007-09-20
Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations Grant 6,921,468 - Graham , et al. July 26, 2	2005-07-26
Semiconductor plating system workpiece support having workpiece engaging electrode with pre-conditioned contact face Grant 6,776,892 - Ritzdorf , et al. August 17, 2	2004-08-17
In-situ cleaning processes for semiconductor electroplating electrodes App 20030201190 - Graham, Lyndon W. ; et al.	2003-10-30
In-situ cleaning processes for semiconductor electroplating electrodes Grant 6,599,412 - Graham , et al. July 29, 2	2003-07-29
Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas App 20030029732 - Ritzdorf, Thomas L. ; et al.	2003-02-13
Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas Grant 6,454,926 - Ritzdorf , et al. September 24, 2	2002-09-24
Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations App 20020046952 - Graham, Lyndon W. ; et al.	2002-04-25
Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations App 20020017456 - Graham, Lyndon W. ; et al.	2002-02-14
Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations Grant 6,270,647 - Graham , et al. August 7, 2	2001-08-07
Semiconductor plating bowl and method using anode shield Grant 6,099,712 - Ritzdorf , et al. August 8, 2	2000-08-08

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