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Patent applications and USPTO patent grants for Turgeon; Michel.The latest application filed is for "thermal interface material on package".
Patent | Date |
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Thermal interface material on package Grant 10,896,862 - De Sousa , et al. January 19, 2 | 2021-01-19 |
Tamper detection at enclosure-to-board interface Grant 10,798,816 - Busby , et al. October 6, 2 | 2020-10-06 |
Tamper detection at enclosure-to-board interface Grant 10,595,401 - Busby , et al. | 2020-03-17 |
Thermal Interface Material On Package App 20180190565 - De Sousa; Isabel ;   et al. | 2018-07-05 |
Thermal interface material on package Grant 9,941,184 - De Sousa , et al. April 10, 2 | 2018-04-10 |
Thermal Interface Material On Package App 20180047655 - DE SOUSA; Isabel ;   et al. | 2018-02-15 |
Thermal interface material on package Grant 9,881,848 - De Sousa , et al. January 30, 2 | 2018-01-30 |
Thermal interface material on package Grant 9,761,505 - De Sousa , et al. September 12, 2 | 2017-09-12 |
Thermal interface material on package Grant 9,646,913 - De Sousa , et al. May 9, 2 | 2017-05-09 |
Thermal interface material on package Grant 9,576,878 - De Sousa , et al. February 21, 2 | 2017-02-21 |
Thermal Interface Material On Package App 20160042977 - DE SOUSA; Isabel ;   et al. | 2016-02-11 |
Thermal Interface Material On Package App 20160042976 - DE SOUSA; Isabel ;   et al. | 2016-02-11 |
Thermal Interface Material On Package App 20160043015 - DE SOUSA; Isabel ;   et al. | 2016-02-11 |
Thermal Interface Material On Package App 20160043016 - DE SOUSA; Isabel ;   et al. | 2016-02-11 |
Thermal interface material on package Grant 9,257,308 - De Sousa , et al. February 9, 2 | 2016-02-09 |
Thermal interface material on package Grant 9,257,307 - De Sousa , et al. February 9, 2 | 2016-02-09 |
Thermal interface material on package Grant 9,252,029 - De Sousa , et al. February 2, 2 | 2016-02-02 |
Thermal interface material on package Grant 9,252,121 - De Sousa , et al. February 2, 2 | 2016-02-02 |
Thermal Interface Material On Package App 20150364341 - DE SOUSA; Isabel ;   et al. | 2015-12-17 |
Thermal Interface Material On Package App 20150364342 - DE SOUSA; Isabel ;   et al. | 2015-12-17 |
Thermal Interface Material On Package App 20150364343 - DE SOUSA; Isabel ;   et al. | 2015-12-17 |
Thermal Interface Material On Package App 20150206851 - DE SOUSA; Isabel ;   et al. | 2015-07-23 |
Injection molded continuously solidified solder method and apparatus App 20050263571 - Belanger, Luc ;   et al. | 2005-12-01 |
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