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name:-0.087846040725708
name:-0.042011976242065
name:-0.003864049911499
Tuominen; Risto Patent Filings

Tuominen; Risto

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tuominen; Risto.The latest application filed is for "circuit board structure and method for manufacturing a circuit board structure".

Company Profile
3.58.56
  • Tuominen; Risto - Helsinki FI
  • Tuominen; Risto - Espoo FI
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Circuit board structure and method for manufacturing a circuit board structure
App 20210392752 - Tuominen; Risto ;   et al.
2021-12-16
Electronic Module
App 20210321520 - Tuominen; Risto ;   et al.
2021-10-14
Circuit board structure and method for manufacturing a circuit board structure
Grant 11,134,572 - Tuominen , et al. September 28, 2
2021-09-28
Electronic module
Grant 11,071,207 - Tuominen , et al. July 20, 2
2021-07-20
Electronic module
App 20210037654 - Tuominen; Risto ;   et al.
2021-02-04
Electronic module
Grant 10,765,006 - Tuominen , et al. Sep
2020-09-01
Electronic module with EMI protection
Grant 10,470,346 - Tuominen No
2019-11-05
Electronic module
App 20180376597 - Tuominen; Risto ;   et al.
2018-12-27
Electronic module with EMI protection
App 20180352689 - Tuominen; Risto
2018-12-06
Electronic module
Grant 10,085,345 - Tuominen , et al. September 25, 2
2018-09-25
Manufacture of a circuit board and circuit board containing a component
Grant 10,085,347 - Tuominen , et al. September 25, 2
2018-09-25
Electronic module with EMI protection
Grant 10,010,019 - Tuominen June 26, 2
2018-06-26
Method for fabrication of an electronic module and electronic module
Grant 9,999,136 - Tuominen June 12, 2
2018-06-12
Circuit module and method of manufacturing the same
Grant 9,883,587 - Palm , et al. January 30, 2
2018-01-30
Multi-chip package and manufacturing method
App 20170271288 - Iihola; Antti ;   et al.
2017-09-21
Multi-chip package and manufacturing method
Grant 9,691,724 - Iihola , et al. June 27, 2
2017-06-27
Method for manufacturing a circuit board structure
Grant 9,622,354 - Tuominen , et al. April 11, 2
2017-04-11
Circuit board structure and method for manufacturing a circuit board structure
App 20170071061 - Tuominen; Risto ;   et al.
2017-03-09
Circuit module and method of manufacturing the same
App 20160212855 - Palm; Petteri ;   et al.
2016-07-21
Method for fabrication of an electronic module and electronic module
App 20160174387 - Tuominen; Risto
2016-06-16
Method for manufacturing an electronic module and an electronic module
Grant 9,363,898 - Tuominen , et al. June 7, 2
2016-06-07
Circuit module and method of manufacturing the same
Grant 9,324,647 - Palm , et al. April 26, 2
2016-04-26
Circuit module and method of manufacturing the same
App 20150348878 - Palm; Petteri ;   et al.
2015-12-03
Manufacture of a circuit board and circuit board containing a component
App 20150289379 - Tuominen; Risto ;   et al.
2015-10-08
Circuit module and method of manufacturing the same
Grant 9,107,324 - Palm , et al. August 11, 2
2015-08-11
Electronic module with EMI protection
App 20150163966 - Tuominen; Risto
2015-06-11
Method for manufacturing an electronic module and an electronic module
App 20150163920 - Tuominen; Risto ;   et al.
2015-06-11
Manufacture of a circuit board containing a component
Grant 8,984,746 - Tuominen , et al. March 24, 2
2015-03-24
Electronic module with EMI protection
Grant 8,964,409 - Tuominen February 24, 2
2015-02-24
Electronic Module
App 20150043177 - Tuominen; Risto ;   et al.
2015-02-12
Single-layer component package
Grant 8,817,485 - Tuominen , et al. August 26, 2
2014-08-26
Circuit module and method of manufacturing the same
App 20140210090 - Palm; Petteri ;   et al.
2014-07-31
Method for manufacturing an electronic module and an electronic module
App 20140208588 - Tuominen; Risto ;   et al.
2014-07-31
Multi-chip package and manufacturing method
App 20140131870 - Iihola; Antti ;   et al.
2014-05-15
Method for manufacturing an electronic module and an electronic module
Grant 8,704,359 - Tuominen , et al. April 22, 2
2014-04-22
Circuit module and method of manufacturing the same
Grant 8,699,233 - Palm , et al. April 15, 2
2014-04-15
Circuit board structure and method for manufacturing a circuit board structure
App 20140059851 - Tuominen; Risto ;   et al.
2014-03-06
Multi-chip package and manufacturing method
Grant 8,659,134 - Iihola , et al. February 25, 2
2014-02-25
Method for manufacturing a circuit board structure
Grant 8,581,109 - Tuominen , et al. November 12, 2
2013-11-12
Electronics module and method for manufacturing the same
Grant 8,547,701 - Tuominen , et al. October 1, 2
2013-10-01
Circuit board including an embedded component
Grant 8,487,194 - Tuominen , et al. July 16, 2
2013-07-16
Electronic module with feed through conductor between wiring patterns
Grant 8,455,994 - Iihola , et al. June 4, 2
2013-06-04
Method for embedding a component in a base
Grant 8,368,201 - Tuominen February 5, 2
2013-02-05
Electronics module comprising an embedded microcircuit
Grant 8,351,214 - Tuominen , et al. January 8, 2
2013-01-08
Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layer
Grant 8,240,032 - Iihola , et al. August 14, 2
2012-08-14
Method for manufacturing a circuit board
Grant 8,240,033 - Tuominen , et al. August 14, 2
2012-08-14
Method for manufacturing a circuit board structure, and a circuit board structure
Grant 8,225,499 - Tuominen , et al. July 24, 2
2012-07-24
Electric module having a conductive pattern layer
Grant 8,222,723 - Tuominen , et al. July 17, 2
2012-07-17
Heat conduction from an embedded component
Grant 8,076,586 - Tuominen , et al. December 13, 2
2011-12-13
Method For Manufacturing An Electronic Module And An Electronic Module
App 20110291293 - Tuominen; Risto ;   et al.
2011-12-01
Method for manufacturing an electronics module
Grant 8,062,537 - Tuominen , et al. November 22, 2
2011-11-22
Method For Embedding A Component In A Base
App 20110266041 - TUOMINEN; Risto
2011-11-03
Electronic module with a conductive-pattern layer and a method of manufacturing same
Grant 8,034,658 - Tuominen , et al. October 11, 2
2011-10-11
Method for embedding a component in a base
Grant 7,989,944 - Tuominen August 2, 2
2011-08-02
Circuit Module And Method Of Manufacturing The Same
App 20110061909 - Palm; Petteri ;   et al.
2011-03-17
Electronic Module With Feed Through Conductor Between Wiring Patterns
App 20100308452 - Iihola; Antti ;   et al.
2010-12-09
Electronics Module Comprising An Embedded Microcircuit
App 20100214750 - TUOMINEN; Risto ;   et al.
2010-08-26
Circuit Board Including An Embedded Component
App 20100202115 - TUOMINEN; Risto ;   et al.
2010-08-12
Electric Module
App 20100202114 - Tuominen; Risto ;   et al.
2010-08-12
Electronic Module With Emi Protection
App 20100202127 - TUOMINEN; Risto
2010-08-12
Method for embedding a component in a base
Grant 7,732,909 - Tuominen June 8, 2
2010-06-08
Electronics module and method for manufacturing the same
Grant 7,719,851 - Tuominen , et al. May 18, 2
2010-05-18
Single-layer Component Package
App 20100103635 - TUOMINEN; Risto ;   et al.
2010-04-29
Electronic Module With A Conductive-pattern Layer And A Method Of Manufacturing Same
App 20100062568 - TUOMINEN; Risto ;   et al.
2010-03-11
Manufacture of a layer including a component
Grant 7,673,387 - Tuominen , et al. March 9, 2
2010-03-09
Multi-chip Package And Manufacturing Method
App 20100052129 - IIHOLA; Antti ;   et al.
2010-03-04
Electronic module with a conductive-pattern layer and a method of manufacturing same
Grant 7,663,215 - Tuominen , et al. February 16, 2
2010-02-16
Electronic module
Grant 7,609,527 - Tuominen , et al. October 27, 2
2009-10-27
Manufacture Of A Circuit Board And Circuit Board Containing A Component
App 20090133251 - Tuominen; Risto ;   et al.
2009-05-28
Method For Manufacturing A Circuit Board Structure, And A Circuit Board Structure
App 20090014872 - Tuominen; Risto ;   et al.
2009-01-15
Manufacture of a Layer Including a Component
App 20080295326 - Tuominen; Risto ;   et al.
2008-12-04
Method For Manufacturing an Electronics Module Comprising a Component Electrically Connected to a Conductor-Pattern Layer
App 20080261338 - Ilhola; Antti ;   et al.
2008-10-23
Electronic Circuit Assembly, Device Comprising Such Assembly and Method for Fabricating Such Device
App 20080253095 - Baraton; Xavier ;   et al.
2008-10-16
Circuit Board Structure and Method for Manufacturing a Circuit Board Structure
App 20080202801 - Tuominen; Risto ;   et al.
2008-08-28
Method for Manufacturing a Circuit Board Structure, and a Circuit Board Structure
App 20080196930 - Tuominen; Risto ;   et al.
2008-08-21
Electronics Module and Method for Manufacturing the Same
App 20080192450 - Tuominen; Risto ;   et al.
2008-08-14
Electronics Module and Method for Manufacturing the Same
App 20080094805 - Tuominen; Risto ;   et al.
2008-04-24
Electronic module
App 20080043441 - Tuominen; Risto ;   et al.
2008-02-21
Method for embedding a component in a base
App 20080036093 - Tuominen; Risto
2008-02-14
Method for manufacturing an electronic module
Grant 7,299,546 - Tuominen , et al. November 27, 2
2007-11-27
Method for Manufacturing an Electronics Module
App 20070267136 - Tuominen; Risto ;   et al.
2007-11-22
Method for embedding a component in a base
Grant 7,294,529 - Tuominen November 13, 2
2007-11-13
Heat Conduction From an Embedded Component
App 20070227761 - Tuominen; Risto ;   et al.
2007-10-04
Method for embedding a component in a base
App 20070206366 - Tuominen; Risto
2007-09-06
Method for manufacturing an electronic module, and an electronic module
App 20070131349 - Tuominen; Risto ;   et al.
2007-06-14
Method for manufacturing an electronic module and an electronic module
App 20060278967 - Tuominen; Risto ;   et al.
2006-12-14
Method for manufacturing an electronic module
App 20060218782 - Tuominen; Risto ;   et al.
2006-10-05
Method for manufacturing an electronic module, and an electronic module
App 20060076686 - Tuominen; Risto ;   et al.
2006-04-13
Method for embedding a component in a base and forming a contact
Grant 6,991,966 - Tuominen January 31, 2
2006-01-31
Method for embedding a component in a base
App 20050224988 - Tuominen, Risto
2005-10-13
Method for embedding a component in a base and forming a contact
App 20050124148 - TUOMINEN, Risto
2005-06-09

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