| Patent | Date |
|---|
Component carrier with electrically conductive layer structures having windows defined by a conformal mask and tapering at least partially
Grant 11,452,212 - Tuominen , et al. September 20, 2 | 2022-09-20 |
Component carrier and method of manufacturing a component carrier
Grant 11,445,601 - Tuominen , et al. September 13, 2 | 2022-09-13 |
Semi-Flex Component Carrier With Dielectric Material Surrounding an Embedded Component and Having Locally Reduced Young Modulus
App 20220256686 - Tuominen; Mikael ; et al. | 2022-08-11 |
Electronic device with embedded component carrier
Grant 11,410,965 - Tuominen August 9, 2 | 2022-08-09 |
Component carrier and method of manufacturing the same
Grant 11,343,916 - Tuominen May 24, 2 | 2022-05-24 |
Semi-Flex Component Carrier With Dielectric Material Having High Elongation and Low Young Modulus
App 20220159828 - Tuominen; Mikael ; et al. | 2022-05-19 |
Component carrier with embedded large die
Grant 11,330,706 - Tay , et al. May 10, 2 | 2022-05-10 |
Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus
Grant 11,291,119 - Tuominen , et al. March 29, 2 | 2022-03-29 |
Component Carrier With Blind Hole Filled With An Electrically Conductive Medium And Fulfilling A Minimum Thickness Design Rule
App 20220095457 - Tuominen; Mikael | 2022-03-24 |
Semi-flex component carrier with dielectric material having high elongation and low young modulus
Grant 11,284,508 - Tuominen , et al. March 22, 2 | 2022-03-22 |
Component Carrier With Low-Solvent Fiber-Free Dielectric Layer
App 20220078923 - Tay; Seok Kim ; et al. | 2022-03-10 |
Component Carrier With Well-Defined Outline Sidewall Cut by Short Laser Pulse and/or Green Laser
App 20220061162 - Tay; Seok Kim ; et al. | 2022-02-24 |
Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design rule
Grant 11,219,129 - Tuominen January 4, 2 | 2022-01-04 |
Stress relief opening for reducing warpage of component carriers
Grant 11,219,120 - Tuominen , et al. January 4, 2 | 2022-01-04 |
Component carrier comprising a component having vertical through connection
Grant 11,211,317 - Tuominen December 28, 2 | 2021-12-28 |
Component Carrier With Improved Bending Performance
App 20210368613 - Xin; Nick ; et al. | 2021-11-25 |
Component carrier with through hole extending through multiple dielectric layers
Grant 11,160,165 - Tuominen , et al. October 26, 2 | 2021-10-26 |
Electronic component embedded by laminate sheet
Grant 11,116,083 - Tay , et al. September 7, 2 | 2021-09-07 |
Component Carrier With Embedded Component Exposed by Blind Hole
App 20210243889 - Tuominen; Mikael ; et al. | 2021-08-05 |
Electronic package comprising a decoupling layer structure
Grant 11,083,081 - Tuominen , et al. August 3, 2 | 2021-08-03 |
Component Carrier Having Component Covered With Ultra-Thin Transition Layer
App 20210227702 - Tuominen; Mikael ; et al. | 2021-07-22 |
Arrangement With Central Carrier And Two Opposing Layer Stacks, Component Carrier and Manufacturing Method
App 20210202427 - Tuominen; Mikael ; et al. | 2021-07-01 |
Component Carrier and Method of Manufacturing a Component Carrier
App 20210204399 - Tuominen; Mikael ; et al. | 2021-07-01 |
Component Carrier With Low Shrinkage Dielectric Material
App 20210202355 - Tuominen; Mikael ; et al. | 2021-07-01 |
Thermally highly conductive coating on base structure accommodating a component
Grant 11,051,391 - Tuominen , et al. June 29, 2 | 2021-06-29 |
Component Carrier and Method of Manufacturing the Same
App 20210185816 - Tuominen; Mikael | 2021-06-17 |
Component Carrier With Embedded Component And Horizontally Elongated Via
App 20210127478 - Feng; Gin ; et al. | 2021-04-29 |
Component Carrier With Electrically Conductive Layer Structures Having Windows Defined By a Conformal Mask and Tapering at Least Partially
App 20210127496 - Tuominen; Mikael ; et al. | 2021-04-29 |
Component Carrier With Through Hole Extending Through Multiple Dielectric Layers
App 20210100095 - Tuominen; Mikael ; et al. | 2021-04-01 |
Component carrier with improved toughness factor
Grant 10,939,548 - Baftiri , et al. March 2, 2 | 2021-03-02 |
Semi-Flex Component Carrier With Dielectric Material Having High Elongation and low Young Modulus
App 20210045235 - Tuominen; Mikael ; et al. | 2021-02-11 |
Semi-Flex Component Carrier With Dielectric Material Surrounding an Embedded Component and Having Locally Reduced Young Modulus
App 20210045249 - Tuominen; Mikael ; et al. | 2021-02-11 |
Component carrier with alternatingly vertically stacked layer structures of different electric density
Grant 10,834,831 - Tuominen November 10, 2 | 2020-11-10 |
Component carrier with different surface finishes
Grant 10,806,027 - Tuominen , et al. October 13, 2 | 2020-10-13 |
Component Carrier Comprising a Component Having Vertical Through Connection
App 20200294900 - Tuominen; Mikael | 2020-09-17 |
Component embedding in thinner core using dielectric sheet
Grant 10,779,415 - Tay , et al. Sept | 2020-09-15 |
Component Carrier With Blind Hole Filled With An Electrically Conductive Medium And Fulfilling A Minimum Thickness Design Rule
App 20200253054 - Kind Code | 2020-08-06 |
Component Carrier With Bridge Structure In Through Hole Fulfilling Minimum Distance Design Rule
App 20200253050 - Kind Code | 2020-08-06 |
Component Carrier With Improved Toughness Factor
App 20200236781 - Baftiri; Artan ; et al. | 2020-07-23 |
Component Carrier With Improved Toughness Factor
App 20200163211 - Baftiri; Artan ; et al. | 2020-05-21 |
Method of Manufacturing a Component Carrier Using a Separation Component, the Component Carrier, and a Semifinished Product
App 20200163223 - Mok; Jeesoo ; et al. | 2020-05-21 |
Component Carrier With Embedded Large Die
App 20200163205 - Tay; Seok Kim ; et al. | 2020-05-21 |
Electronic Package Comprising a Decoupling Layer Structure
App 20200163206 - Tuominen; Mikael ; et al. | 2020-05-21 |
Component Carrier With Improved Bending Performance
App 20200154558 - Xin; Nick ; et al. | 2020-05-14 |
Component carrier with improved toughness factor
Grant 10,653,009 - Baftiri , et al. | 2020-05-12 |
Sensor system
Grant 10,651,215 - Tuominen | 2020-05-12 |
Electronic device with a plurality of component carrier packages being electrically and mechanically connected
Grant 10,643,928 - Tuominen | 2020-05-05 |
Electronic component packaged in component carrier serving as shielding cage
Grant 10,643,953 - Tuominen , et al. | 2020-05-05 |
Stress Relief Opening for Reducing Warpage of Component Carriers
App 20200100358 - Tuominen; Mikael ; et al. | 2020-03-26 |
Component carrier and manufacturing method
Grant 10,595,414 - Tuominen | 2020-03-17 |
Packaged Integrated Circuit With Interposing Functionality and Method for Manufacturing Such a Packaged Integrated Circuit
App 20190326188 - Tuominen; Mikael ; et al. | 2019-10-24 |
Electronic Component Embedded by Laminate Sheet
App 20190254169 - TAY; Annie ; et al. | 2019-08-15 |
Component Embedding in Thinner Core Using Dielectric Sheet
App 20190116671 - TAY; Annie ; et al. | 2019-04-18 |
Electronic Component Packaged in Component Carrier Serving as Shielding Cage
App 20180358302 - Tuominen; Mikael ; et al. | 2018-12-13 |
Electronic Device With a Plurality of Component Carrier Packages Being Electrically and Mechanically Connected
App 20180350725 - Tuominen; Mikael | 2018-12-06 |
Component Carrier With Alternatingly Vertically Stacked Layer Structures of Different Electric Density
App 20180343751 - Tuominen; Mikael | 2018-11-29 |
Component Carrier and Manufacturing Method
App 20180288879 - Tuominen; Mikael | 2018-10-04 |
Thermally Highly Conductive Coating on Base Structure Accommodating a Component
App 20180213634 - TUOMINEN; Mikael ; et al. | 2018-07-26 |
Electronic Device With Embedded Component Carrier
App 20180199438 - Tuominen; Mikael | 2018-07-12 |
Sensor System
App 20180182796 - Tuominen; Mikael | 2018-06-28 |
Semi-finished product for the production of a printed circuit board and method for producing the same
Grant 9,820,381 - Wang , et al. November 14, 2 | 2017-11-14 |
Printed circuit board having a ground plane with angled openings oriented between 30 to 60 degrees
Grant 9,801,270 - Tuominen , et al. October 24, 2 | 2017-10-24 |
Semi-finished product for the production of a printed circuit board and method for producing the same
Grant 9,781,845 - Stahr , et al. October 3, 2 | 2017-10-03 |
Component Carrier With Different Surface Finishes
App 20170196081 - Tuominen; Mikael ; et al. | 2017-07-06 |
Method for producing a circuit board and use of such a method
Grant 9,648,758 - Gotzinger , et al. May 9, 2 | 2017-05-09 |
Printed circuit board with crosstalk reduction features
Grant 9,521,743 - Fischeneder , et al. December 13, 2 | 2016-12-13 |
Semi-finished Product for the Production of a Printed Circuit Board and Method for Producing the Same
App 20160021763 - Stahr; Johannes ; et al. | 2016-01-21 |
Printed Circuit Board
App 20150366051 - Fischeneder; Martin ; et al. | 2015-12-17 |
Semi-Finished Product for the Production of a Printed Circuit Board and Method for Producing the Same
App 20150334833 - Wang; Vic ; et al. | 2015-11-19 |
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