Tunga; Krishna R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tunga; Krishna R..The latest application filed is for "mitigating cooldown peeling stress during chip package assembly".

Company Profile

28.37.36

Tunga; Krishna R. - Wappingers Falls NY
Tunga; Krishna R. - Wappiners Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Mitigating Cooldown Peeling Stress During Chip Package Assembly App 20220208693 - Farooq; Mukta Ghate ; et al.	2022-06-30
Language learning and speech enhancement through natural language processing Grant 11,302,205 - Amin , et al. April 12, 2	2022-04-12
Laminated stiffener to control the warpage of electronic chip carriers Grant 11,302,651 - Sikka , et al. April 12, 2	2022-04-12
Asymmetric Die Bonding App 20220093556 - Sakuma; Katsuyuki ; et al.	2022-03-24
Enlarged conductive pad structures for enhanced chip bond assembly yield Grant 11,282,773 - Tunga , et al. March 22, 2	2022-03-22
Internet Of Things (iot) Real-time Response To Defined Symptoms App 20220032000 - Amin; Mahmoud ; et al.	2022-02-03
Mitigating thermal-mechanical strain and warpage of an organic laminate substrate Grant 11,239,183 - Sinha , et al. February 1, 2	2022-02-01
Behavior-based interactive educational sessions Grant 11,210,968 - Clevenger , et al. December 28, 2	2021-12-28
Internet of things (IOT) real-time response to defined symptoms Grant 11,185,658 - Amin , et al. November 30, 2	2021-11-30
Enlarged Conductive Pad Structures For Enhanced Chip Bond Assembly Yield App 20210320056 - Tunga; Krishna R. ; et al.	2021-10-14
Mitigating Thermal-mechanical Strain And Warpage Of An Organic Laminate Substrate App 20210242139 - Sinha; Tuhin ; et al.	2021-08-05
Mitigating cracking within integrated circuit (IC) device carrier Grant 10,985,129 - Lombardi , et al. April 20, 2	2021-04-20
Language Learning And Speech Enhancement Through Natural Language Processing App 20210110727 - Amin; Mahmoud ; et al.	2021-04-15
Lead-free column interconnect Grant 10,950,573 - Arvin , et al. March 16, 2	2021-03-16
Language learning and speech enhancement through natural language processing Grant 10,916,154 - Amin , et al. February 9, 2	2021-02-09
Managing thermal warpage of a laminate Grant 10,832,987 - Arvin , et al. November 10, 2	2020-11-10
Mitigating Cracking Within Integrated Circuit (IC) Device Carrier App 20200328177 - Lombardi; Thomas E. ; et al.	2020-10-15
Lead-free Column Interconnect App 20200303339 - ARVIN; CHARLES L. ; et al.	2020-09-24
Multipart lid for a semiconductor package with multiple components Grant 10,777,482 - Arvin , et al. Sept	2020-09-15
Connected plane stiffener within integrated circuit chip carrier Grant 10,770,385 - Call , et al. Sep	2020-09-08
Decoupling capacitor stiffener Grant 10,756,031 - Arvin , et al. A	2020-08-25
Electronic package cover having underside rib Grant 10,665,524 - Sikka , et al.	2020-05-26
Cognitive Computing Device For Predicting An Optimal Strategy In Competitive Circumstances App 20200160228 - Amin; Mahmoud ; et al.	2020-05-21
Method of forming an electronic package Grant 10,636,746 - Sikka , et al.	2020-04-28
Electronic package cover having underside rib Grant 10,622,275 - Sikka , et al.	2020-04-14
Final passivation for wafer level warpage and ULK stress reduction Grant 10,622,319 - Misra , et al.	2020-04-14
Behavior-based Interactive Educational Sessions App 20200090542 - Clevenger; Lawrence A. ; et al.	2020-03-19
Internet Of Things (iot) Real-time Response To Defined Symptoms App 20200066127 - Amin; Mahmoud ; et al.	2020-02-27
Cognitive Tool For Teaching Generlization Of Objects To A Person App 20200051447 - Tunga; Krishna R. ; et al.	2020-02-13
Connected Plane Stiffener Within Integrated Circuit Chip Carrier App 20200035593 - Call; Anson J. ; et al.	2020-01-30
Control warpage in a semiconductor chip package Grant 10,541,211 - Sinha , et al. Ja	2020-01-21
Laminated Stiffener To Control The Warpage Of Electronic Chip Carriers App 20200013732 - Sikka; Kamal K. ; et al.	2020-01-09
Optimized Individual Sleep Patterns App 20190357843 - AMIN; MAHMOUD ; et al.	2019-11-28
Optimized individual sleep patterns Grant 10,426,400 - Amin , et al. October 1, 2	2019-10-01
Managing Thermal Warpage Of A Laminate App 20190295921 - Arvin; Charles L. ; et al.	2019-09-26
Optimized individual sleep patterns Grant 10,420,502 - Amin , et al. Sept	2019-09-24
Electronic package with tapered pedestal Grant 10,424,527 - Sikka , et al. Sept	2019-09-24
Laminated Stiffener To Control The Warpage Of Electronic Chip Carriers App 20190267332 - SIKKA; Kamal K. ; et al.	2019-08-29
Multipart Lid For A Semiconductor Package With Multiple Components App 20190259683 - ARVIN; CHARLES L. ; et al.	2019-08-22
Test cell for laminate and method Grant 10,381,276 - Iruvanti , et al. A	2019-08-13
Multipart lid for a semiconductor package with multiple components Grant 10,325,830 - Arvin , et al.	2019-06-18
Multipart Lid For A Semiconductor Package With Multiple Components App 20190164864 - ARVIN; CHARLES L. ; et al.	2019-05-30
Electronic Package With Tapered Pedestal App 20190148260 - Sikka; Kamal K. ; et al.	2019-05-16
Method of fabricating contacts of an electronic package structure to reduce solder interconnect stress Grant 10,276,535 - Call , et al.	2019-04-30
Reduction of solder interconnect stress Grant 10,276,534 - Call , et al.	2019-04-30
Language Learning And Speech Enhancement Through Natural Language Processing App 20190122574 - Amin; Mahmoud ; et al.	2019-04-25
Test cell for laminate and method Grant 10,249,548 - Iruvanti , et al.	2019-04-02
Optimized Individual Sleep Patterns App 20180368757 - AMIN; Mahmoud ; et al.	2018-12-27
Optimized Individual Sleep Patterns App 20180368756 - AMIN; MAHMOUD ; et al.	2018-12-27
Laminate substrate thermal warpage prediction for designing a laminate substrate Grant 10,108,753 - Call , et al. October 23, 2	2018-10-23
Control Warpage In A Semiconductor Chip Package App 20180301355 - Sinha; Tuhin ; et al.	2018-10-18
Final Passivation For Wafer Level Warpage And Ulk Stress Reduction App 20180108626 - Misra; Ekta ; et al.	2018-04-19
Determining crackstop strength of integrated circuit assembly at the wafer level Grant 9,947,598 - Tunga , et al. April 17, 2	2018-04-17
Electronic Package Cover Having Underside Rib App 20180082922 - Sikka; Kamal K. ; et al.	2018-03-22
Electronic Package Cover Having Underside Rib App 20180082919 - Sikka; Kamal K. ; et al.	2018-03-22
Test Cell For Laminate And Method App 20180076101 - Iruvanti; Sushumna ; et al.	2018-03-15
Reduction Of Solder Interconnect Stress App 20180061799 - Call; Anson J. ; et al.	2018-03-01
Reduction Of Solder Interconnect Stress App 20180061800 - Call; Anson J. ; et al.	2018-03-01
Reduction of solder interconnect stress Grant 9,865,557 - Call , et al. January 9, 2	2018-01-09
Laminate Substrate Thermal Warpage Prediction For Designing A Laminate Substrate App 20170351783 - Call; Anson J. ; et al.	2017-12-07
Electronic package cover having underside rib Grant 9,837,333 - Sikka , et al. December 5, 2	2017-12-05
Final passivation for wafer level warpage and ULK stress reduction Grant 9,754,905 - Misra , et al. September 5, 2	2017-09-05
Test Cell For Laminate And Method App 20170178982 - Iruvanti; Sushumna ; et al.	2017-06-22
In-plane copper imbalance for warpage prediction Grant 9,563,732 - Call , et al. February 7, 2	2017-02-07
Non-hermetic sealed multi-chip module package Grant 9,105,500 - Bodenweber , et al. August 11, 2	2015-08-11
Multichip electronic packages and methods of manufacture Grant 8,860,206 - Sikka , et al. October 14, 2	2014-10-14
Multichip Electronic Packages And Methods Of Manufacture App 20140027898 - SIKKA; Kamal K. ; et al.	2014-01-30
Non-hermetic Sealed Multi-chip Module Package App 20140015387 - Bodenweber; Paul F. ; et al.	2014-01-16
Multichip electronic packages and methods of manufacture Grant 8,592,970 - Sikka , et al. November 26, 2	2013-11-26
Multichip Electronic Packages And Methods Of Manufacture App 20120326294 - SIKKA; KAMAL K. ; et al.	2012-12-27