loadpatents
Patent applications and USPTO patent grants for Tunga; Krishna R..The latest application filed is for "mitigating cooldown peeling stress during chip package assembly".
Patent | Date |
---|---|
Mitigating Cooldown Peeling Stress During Chip Package Assembly App 20220208693 - Farooq; Mukta Ghate ;   et al. | 2022-06-30 |
Language learning and speech enhancement through natural language processing Grant 11,302,205 - Amin , et al. April 12, 2 | 2022-04-12 |
Laminated stiffener to control the warpage of electronic chip carriers Grant 11,302,651 - Sikka , et al. April 12, 2 | 2022-04-12 |
Asymmetric Die Bonding App 20220093556 - Sakuma; Katsuyuki ;   et al. | 2022-03-24 |
Enlarged conductive pad structures for enhanced chip bond assembly yield Grant 11,282,773 - Tunga , et al. March 22, 2 | 2022-03-22 |
Internet Of Things (iot) Real-time Response To Defined Symptoms App 20220032000 - Amin; Mahmoud ;   et al. | 2022-02-03 |
Mitigating thermal-mechanical strain and warpage of an organic laminate substrate Grant 11,239,183 - Sinha , et al. February 1, 2 | 2022-02-01 |
Behavior-based interactive educational sessions Grant 11,210,968 - Clevenger , et al. December 28, 2 | 2021-12-28 |
Internet of things (IOT) real-time response to defined symptoms Grant 11,185,658 - Amin , et al. November 30, 2 | 2021-11-30 |
Enlarged Conductive Pad Structures For Enhanced Chip Bond Assembly Yield App 20210320056 - Tunga; Krishna R. ;   et al. | 2021-10-14 |
Mitigating Thermal-mechanical Strain And Warpage Of An Organic Laminate Substrate App 20210242139 - Sinha; Tuhin ;   et al. | 2021-08-05 |
Mitigating cracking within integrated circuit (IC) device carrier Grant 10,985,129 - Lombardi , et al. April 20, 2 | 2021-04-20 |
Language Learning And Speech Enhancement Through Natural Language Processing App 20210110727 - Amin; Mahmoud ;   et al. | 2021-04-15 |
Lead-free column interconnect Grant 10,950,573 - Arvin , et al. March 16, 2 | 2021-03-16 |
Language learning and speech enhancement through natural language processing Grant 10,916,154 - Amin , et al. February 9, 2 | 2021-02-09 |
Managing thermal warpage of a laminate Grant 10,832,987 - Arvin , et al. November 10, 2 | 2020-11-10 |
Mitigating Cracking Within Integrated Circuit (IC) Device Carrier App 20200328177 - Lombardi; Thomas E. ;   et al. | 2020-10-15 |
Lead-free Column Interconnect App 20200303339 - ARVIN; CHARLES L. ;   et al. | 2020-09-24 |
Multipart lid for a semiconductor package with multiple components Grant 10,777,482 - Arvin , et al. Sept | 2020-09-15 |
Connected plane stiffener within integrated circuit chip carrier Grant 10,770,385 - Call , et al. Sep | 2020-09-08 |
Decoupling capacitor stiffener Grant 10,756,031 - Arvin , et al. A | 2020-08-25 |
Electronic package cover having underside rib Grant 10,665,524 - Sikka , et al. | 2020-05-26 |
Cognitive Computing Device For Predicting An Optimal Strategy In Competitive Circumstances App 20200160228 - Amin; Mahmoud ;   et al. | 2020-05-21 |
Method of forming an electronic package Grant 10,636,746 - Sikka , et al. | 2020-04-28 |
Final passivation for wafer level warpage and ULK stress reduction Grant 10,622,319 - Misra , et al. | 2020-04-14 |
Electronic package cover having underside rib Grant 10,622,275 - Sikka , et al. | 2020-04-14 |
Behavior-based Interactive Educational Sessions App 20200090542 - Clevenger; Lawrence A. ;   et al. | 2020-03-19 |
Internet Of Things (iot) Real-time Response To Defined Symptoms App 20200066127 - Amin; Mahmoud ;   et al. | 2020-02-27 |
Cognitive Tool For Teaching Generlization Of Objects To A Person App 20200051447 - Tunga; Krishna R. ;   et al. | 2020-02-13 |
Connected Plane Stiffener Within Integrated Circuit Chip Carrier App 20200035593 - Call; Anson J. ;   et al. | 2020-01-30 |
Control warpage in a semiconductor chip package Grant 10,541,211 - Sinha , et al. Ja | 2020-01-21 |
Laminated Stiffener To Control The Warpage Of Electronic Chip Carriers App 20200013732 - Sikka; Kamal K. ;   et al. | 2020-01-09 |
Optimized Individual Sleep Patterns App 20190357843 - AMIN; MAHMOUD ;   et al. | 2019-11-28 |
Optimized individual sleep patterns Grant 10,426,400 - Amin , et al. October 1, 2 | 2019-10-01 |
Managing Thermal Warpage Of A Laminate App 20190295921 - Arvin; Charles L. ;   et al. | 2019-09-26 |
Optimized individual sleep patterns Grant 10,420,502 - Amin , et al. Sept | 2019-09-24 |
Electronic package with tapered pedestal Grant 10,424,527 - Sikka , et al. Sept | 2019-09-24 |
Laminated Stiffener To Control The Warpage Of Electronic Chip Carriers App 20190267332 - SIKKA; Kamal K. ;   et al. | 2019-08-29 |
Multipart Lid For A Semiconductor Package With Multiple Components App 20190259683 - ARVIN; CHARLES L. ;   et al. | 2019-08-22 |
Test cell for laminate and method Grant 10,381,276 - Iruvanti , et al. A | 2019-08-13 |
Multipart lid for a semiconductor package with multiple components Grant 10,325,830 - Arvin , et al. | 2019-06-18 |
Multipart Lid For A Semiconductor Package With Multiple Components App 20190164864 - ARVIN; CHARLES L. ;   et al. | 2019-05-30 |
Electronic Package With Tapered Pedestal App 20190148260 - Sikka; Kamal K. ;   et al. | 2019-05-16 |
Method of fabricating contacts of an electronic package structure to reduce solder interconnect stress Grant 10,276,535 - Call , et al. | 2019-04-30 |
Reduction of solder interconnect stress Grant 10,276,534 - Call , et al. | 2019-04-30 |
Language Learning And Speech Enhancement Through Natural Language Processing App 20190122574 - Amin; Mahmoud ;   et al. | 2019-04-25 |
Test cell for laminate and method Grant 10,249,548 - Iruvanti , et al. | 2019-04-02 |
Optimized Individual Sleep Patterns App 20180368757 - AMIN; Mahmoud ;   et al. | 2018-12-27 |
Optimized Individual Sleep Patterns App 20180368756 - AMIN; MAHMOUD ;   et al. | 2018-12-27 |
Laminate substrate thermal warpage prediction for designing a laminate substrate Grant 10,108,753 - Call , et al. October 23, 2 | 2018-10-23 |
Control Warpage In A Semiconductor Chip Package App 20180301355 - Sinha; Tuhin ;   et al. | 2018-10-18 |
Final Passivation For Wafer Level Warpage And Ulk Stress Reduction App 20180108626 - Misra; Ekta ;   et al. | 2018-04-19 |
Determining crackstop strength of integrated circuit assembly at the wafer level Grant 9,947,598 - Tunga , et al. April 17, 2 | 2018-04-17 |
Electronic Package Cover Having Underside Rib App 20180082922 - Sikka; Kamal K. ;   et al. | 2018-03-22 |
Electronic Package Cover Having Underside Rib App 20180082919 - Sikka; Kamal K. ;   et al. | 2018-03-22 |
Test Cell For Laminate And Method App 20180076101 - Iruvanti; Sushumna ;   et al. | 2018-03-15 |
Reduction Of Solder Interconnect Stress App 20180061799 - Call; Anson J. ;   et al. | 2018-03-01 |
Reduction Of Solder Interconnect Stress App 20180061800 - Call; Anson J. ;   et al. | 2018-03-01 |
Reduction of solder interconnect stress Grant 9,865,557 - Call , et al. January 9, 2 | 2018-01-09 |
Laminate Substrate Thermal Warpage Prediction For Designing A Laminate Substrate App 20170351783 - Call; Anson J. ;   et al. | 2017-12-07 |
Electronic package cover having underside rib Grant 9,837,333 - Sikka , et al. December 5, 2 | 2017-12-05 |
Final passivation for wafer level warpage and ULK stress reduction Grant 9,754,905 - Misra , et al. September 5, 2 | 2017-09-05 |
Test Cell For Laminate And Method App 20170178982 - Iruvanti; Sushumna ;   et al. | 2017-06-22 |
In-plane copper imbalance for warpage prediction Grant 9,563,732 - Call , et al. February 7, 2 | 2017-02-07 |
Non-hermetic sealed multi-chip module package Grant 9,105,500 - Bodenweber , et al. August 11, 2 | 2015-08-11 |
Multichip electronic packages and methods of manufacture Grant 8,860,206 - Sikka , et al. October 14, 2 | 2014-10-14 |
Multichip Electronic Packages And Methods Of Manufacture App 20140027898 - SIKKA; Kamal K. ;   et al. | 2014-01-30 |
Non-hermetic Sealed Multi-chip Module Package App 20140015387 - Bodenweber; Paul F. ;   et al. | 2014-01-16 |
Multichip electronic packages and methods of manufacture Grant 8,592,970 - Sikka , et al. November 26, 2 | 2013-11-26 |
Multichip Electronic Packages And Methods Of Manufacture App 20120326294 - SIKKA; KAMAL K. ;   et al. | 2012-12-27 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.