Tung; Tsan-Hua

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tung; Tsan-Hua.The latest application filed is for "methods of packaging semiconductor devices and structures thereof".

Company Profile

1.9.10

Tung; Tsan-Hua - Tainan TW
Tung; Tsan-Hua - Tainan City TW
Tung; Tsan-Hua - Hsin-Chu TW
Tung; Tsan-Hua - Hsinchu TW
TUNG; Tsan-Hua - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods of packaging semiconductor devices including placing semiconductor devices into die caves Grant 10,964,594 - Lin , et al. March 30, 2	2021-03-30
Methods Of Packaging Semiconductor Devices And Structures Thereof App 20190122929 - Lin; Jing-Cheng ; et al.	2019-04-25
Methods of packaging semiconductor devices including placing semiconductor devices into die caves Grant 10,163,711 - Lin , et al. Dec	2018-12-25
Methods of Packaging Semiconductor Devices and Structures Thereof App 20170271209 - Lin; Jing-Cheng ; et al.	2017-09-21
Methods of packaging semiconductor devices and structures thereof Grant 9,673,098 - Lin , et al. June 6, 2	2017-06-06
Methods of Packaging Semiconductor Devices and Structures Thereof App 20160343615 - Lin; Jing-Cheng ; et al.	2016-11-24
Methods of packaging semiconductor devices and structures thereof Grant 9,406,581 - Lin , et al. August 2, 2	2016-08-02
Method of packaging a semiconductor device Grant 9,312,148 - Lin , et al. April 12, 2	2016-04-12
Methods of Packaging Semiconductor Devices and Structures Thereof App 20150364395 - Lin; Jing-Cheng ; et al.	2015-12-17
Methods of packaging semiconductor devices and structures thereof Grant 9,117,682 - Lin , et al. August 25, 2	2015-08-25
Method Of Packaging A Semiconductor Device App 20150187605 - LIN; Jing-Cheng ; et al.	2015-07-02
Packaged semiconductor device with a molding compound and a method of forming the same Grant 9,000,584 - Lin , et al. April 7, 2	2015-04-07
Packaged Semiconductor Device And Method Of Packaging The Semiconductor Device App 20130168848 - LIN; Jing-Cheng ; et al.	2013-07-04
Methods of Packaging Semiconductor Devices and Structures Thereof App 20130087916 - Lin; Jing-Cheng ; et al.	2013-04-11
New-type Chitosan-based Hybrid Macromolecule And A Method For Producing Or Using The Macromolecule App 20120153520 - LIU; Dean-Mo ; et al.	2012-06-21

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