| Patent | Date |
|---|
Etch Stop Layer for Semiconductor Devices
App 20220254680 - Tung; Szu-Ping ; et al. | 2022-08-11 |
Etch stop layer for semiconductor devices
Grant 11,322,396 - Tung , et al. May 3, 2 | 2022-05-03 |
Patterning Material Including Carbon-containing Layer And Method For Semiconductor Device Fabrication
App 20220102200 - TUNG; Szu-Ping ; et al. | 2022-03-31 |
Patterning Material Including Silicon-containing Layer And Method For Semiconductor Device Fabrication
App 20220102150 - TUNG; Szu-Ping ; et al. | 2022-03-31 |
Metal-Based Etch-Stop Layer
App 20210280460 - Tung; Szu-Ping ; et al. | 2021-09-09 |
Method of Forming an Interconnect Structure Having an Air Gap and Structure Thereof
App 20210265272 - Tung; Szu-Ping ; et al. | 2021-08-26 |
Metal-based etch-stop layer
Grant 11,004,734 - Tung , et al. May 11, 2 | 2021-05-11 |
Method of forming an interconnect structure having an air gap and structure thereof
Grant 11,004,793 - Tung , et al. May 11, 2 | 2021-05-11 |
Memory Device And Method For Fabricating The Same
App 20210119120 - WU; Jung-Tang ; et al. | 2021-04-22 |
Thin-film Non-uniform Stress Evaluation
App 20210066139 - HO; Wei-De ; et al. | 2021-03-04 |
Patterning method for semiconductor devices and structures resulting therefrom
Grant 10,867,794 - Chang , et al. December 15, 2 | 2020-12-15 |
Memory device
Grant 10,862,026 - Wu , et al. December 8, 2 | 2020-12-08 |
Patterning Method for Semiconductor Devices and Structures Resulting Therefrom
App 20200312662 - Chang; Ching-Yu ; et al. | 2020-10-01 |
Etch Stop Layer for Semiconductor Devices
App 20200279770 - Tung; Szu-Ping ; et al. | 2020-09-03 |
Etch stop layer for semiconductor devices
Grant 10,685,873 - Tung , et al. | 2020-06-16 |
Memory Device
App 20200152864 - WU; Jung-Tang ; et al. | 2020-05-14 |
Metal-Based Etch-Stop Layer
App 20200066581 - Tung; Szu-Ping ; et al. | 2020-02-27 |
Via structure, MRAM device using the via structure and method for fabricating the MRAM device
Grant 10,535,816 - Wu , et al. Ja | 2020-01-14 |
Metal-based etch-stop layer
Grant 10,468,297 - Tung , et al. No | 2019-11-05 |
Metal-Based Etch-Stop Layer
App 20190333807 - Tung; Szu-Ping ; et al. | 2019-10-31 |
Method of Forming an Interconnect Structure Having an Air Gap and Structure Thereof
App 20190326220 - Tung; Szu-Ping ; et al. | 2019-10-24 |
Method of forming an interconnect structure having an air gap and structure thereof
Grant 10,340,223 - Tung , et al. | 2019-07-02 |
Via Structure, Mram Device Using The Via Structure And Method For Fabricating The Mram Device
App 20190157548 - WU; Jung-Tang ; et al. | 2019-05-23 |
Etch Stop Layer for Semiconductor Devices
App 20180350666 - Tung; Szu-Ping ; et al. | 2018-12-06 |
Semiconductor devices and methods of forming same
Grant 10,103,099 - Chi , et al. October 16, 2 | 2018-10-16 |
Method of Forming an Interconnect Structure Having an Air Gap and Structure Thereof
App 20180204801 - Tung; Szu-Ping ; et al. | 2018-07-19 |
Method of forming an interconnect structure having an air gap and structure thereof
Grant 9,917,058 - Tung , et al. March 13, 2 | 2018-03-13 |
Metal capping process and processing platform thereof
Grant 9,873,944 - Chi , et al. January 23, 2 | 2018-01-23 |
Etch Stop Layer for Semiconductor Devices
App 20180005876 - Tung; Szu-Ping ; et al. | 2018-01-04 |
Semiconductor Devices and Methods of Forming Same
App 20170162502 - Chi; Chih-Chien ; et al. | 2017-06-08 |
Self-aligned repairing process for barrier layer
Grant 9,640,428 - Chi , et al. May 2, 2 | 2017-05-02 |
Method for integrated circuit patterning
Grant 9,589,800 - Tung , et al. March 7, 2 | 2017-03-07 |
Method of Forming an Interconnect Structure Having an Air Gap and Structure Thereof
App 20170062341 - Tung; Szu-Ping ; et al. | 2017-03-02 |
Semiconductor devices and methods of forming same
Grant 9,576,892 - Chi , et al. February 21, 2 | 2017-02-21 |
Metal Capping Process And Processing Platform Thereof
App 20170044668 - Chi; Chih-Chien ; et al. | 2017-02-16 |
Structure and method for forming interconnect structure
Grant 9,543,198 - Chi , et al. January 10, 2 | 2017-01-10 |
Selective repairing process for barrier layer
Grant 9,514,928 - Chi , et al. December 6, 2 | 2016-12-06 |
Method of forming an interconnect structure having an air gap and structure thereof
Grant 9,496,169 - Tung , et al. November 15, 2 | 2016-11-15 |
Metal capping process and processing platform thereof
Grant 9,487,864 - Chi , et al. November 8, 2 | 2016-11-08 |
Method of Forming an Interconnect Structure Having an Air Gap and Structure Thereof
App 20160240428 - Tung; Szu-Ping ; et al. | 2016-08-18 |
Self-aligned Repairing Process For Barrier Layer
App 20160204060 - CHI; Chih-Chien ; et al. | 2016-07-14 |
Self-aligned repairing process for barrier layer
Grant 9,324,606 - Chi , et al. April 26, 2 | 2016-04-26 |
Method for Integrated Circuit Patterning
App 20160071730 - Tung; Szu-Ping ; et al. | 2016-03-10 |
Hard mask edge cover scheme
Grant 9,218,986 - Tung , et al. December 22, 2 | 2015-12-22 |
Method for integrated circuit patterning
Grant 9,129,814 - Tung , et al. September 8, 2 | 2015-09-08 |
Interconnect Structure And Method of Forming
App 20150206798 - Chi; Chih-Chien ; et al. | 2015-07-23 |
Selective Repairing Process For Barrier Layer
App 20150201501 - Chi; Chih-Chien ; et al. | 2015-07-16 |
Metal Capping Process And Processing Platform Thereof
App 20150200132 - Chi; Chih-Chien ; et al. | 2015-07-16 |
Self-aligned Repairing Process For Barrier Layer
App 20150194343 - CHI; Chih-Chien ; et al. | 2015-07-09 |
Method For Integrated Circuit Patterning
App 20150147886 - Tung; Szu-Ping ; et al. | 2015-05-28 |
Structure and Method for Forming Interconnect Structure
App 20150123279 - Chi; Chih-Chien ; et al. | 2015-05-07 |
Interconnect structures and methods of forming same
Grant 8,980,745 - Tung , et al. March 17, 2 | 2015-03-17 |
Semiconductor Devices and Methods of Forming Same
App 20150069620 - Chi; Chih-Chien ; et al. | 2015-03-12 |
Hard Mask Edge Cover Scheme
App 20150072528 - Tung; Szu-Ping ; et al. | 2015-03-12 |
Interconnect Structures And Methods Of Forming Same
App 20150061141 - Tung; Szu-Ping ; et al. | 2015-03-05 |
Structure and method for forming interconnect structure
Grant 8,940,635 - Chi , et al. January 27, 2 | 2015-01-27 |
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