Tung; I-Chung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tung; I-Chung.The latest application filed is for "fine pad pitch organic circuit board with plating solder and method for fabricating the same".

Company Profile

0.4.9

Tung; I-Chung - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fine Pad Pitch Organic Circuit Board With Plating Solder And Method For Fabricating The Same App 20060201997 - Tung; I-Chung	2006-09-14
Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints Grant 7,098,126 - Hsieh , et al. August 29, 2	2006-08-29
Method for making a multilayer circuit board having embedded passive components Grant 6,910,264 - Tung June 28, 2	2005-06-28
Method for making a multilayer circuit board having embedded passive components App 20040128822 - Tung, I-Chung	2004-07-08
Fine pad pitch organic circuit board for flip chip joints and board to board solder joints and method App 20040084206 - Tung, I-Chung	2004-05-06
Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints App 20030022477 - Hsieh, Han-Kun ; et al.	2003-01-30
Pin attachment by a surface mounting method for fabricating organic pin grid array packages App 20020179692 - Tung, I-Chung ; et al.	2002-12-05
Lamination method of embedding passive components in an organic circuit board App 20020182374 - Tung, I-Chung	2002-12-05
Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier Grant 6,475,327 - Tung , et al. November 5, 2	2002-11-05
Thin core substrate for fabricating a build-up circuit board App 20020152611 - Tung, I-Chung ; et al.	2002-10-24
Attachment Of A Stiff Heat Spreader For Fabricating A Cavity Down Plastic Chip Carrier App 20020144775 - Tung, I-Chung ; et al.	2002-10-10
Attachment of a heat spreader for fabricating a cavity down plastic chip carrier App 20020124955 - Tung, I-Chung ; et al.	2002-09-12
Ultrasound-enhanced devolatilization of thermoplastic plastics Grant 5,468,429 - Li , et al. November 21, 1	1995-11-21

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