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Embedded Semiconductor Packages And Methods Thereof
App 20220230948 - OGURA; Nobuo ; et al. | 2022-07-21 |
Substrate-compatible Inductors With Magnetic Layers
App 20210036095 - PULUGURTHA; Markondeya Raj ; et al. | 2021-02-04 |
Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same
Grant 10,672,718 - Sundaram , et al. | 2020-06-02 |
Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrate
Grant 9,417,415 - Tummala , et al. August 16, 2 | 2016-08-16 |
Through-package-via (tpv) Structures On Inorganic Interposer And Methods For Fabricating Same
App 20160141257 - Sundaram; Venkatesh ; et al. | 2016-05-19 |
Package-level Electromagnetic Interference Shielding Structures For A Substrate
App 20160113108 - SUNDARAM; Venkatesh ; et al. | 2016-04-21 |
New Structure Of Microelectronic Packages With Edge Protection By Coating
App 20160111380 - SUNDARAM; Venkatesh ; et al. | 2016-04-21 |
Optical Interconnects And Methods Of Fabricating Same
App 20160109653 - Vis; William A. ; et al. | 2016-04-21 |
Interconnect structures and methods of making the same
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Ultra-thin interposer assemblies with through vias
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Stress relieving second level interconnect structures and methods of making the same
Grant 8,970,036 - Raj , et al. March 3, 2 | 2015-03-03 |
Glass-Polymer Optical Interposer
App 20140355931 - Tummala; Rao R. ; et al. | 2014-12-04 |
Magnetic Device Utilizing Nanocomposite Films Layered With Adhesives
App 20140347157 - Pulugurtha; Markondeya Raj ; et al. | 2014-11-27 |
Interconnect assemblies and methods of making and using same
Grant 8,633,601 - Kumbhat , et al. January 21, 2 | 2014-01-21 |
Second Level Interconnect Structures and Methods of Making the Same
App 20130270695 - Raj; Pulugurtha Markondeya ; et al. | 2013-10-17 |
Chip-last embedded interconnect structures
Grant 8,536,695 - Liu , et al. September 17, 2 | 2013-09-17 |
Through-Package-Via (TPV) Structures On Inorganic Interposer And Methods For Fabricating Same
App 20130119555 - Sundaram; Venkatesh ; et al. | 2013-05-16 |
Interconnect Structures And Methods Of Making The Same
App 20130107485 - Raj; Pulugurtha Markondeya ; et al. | 2013-05-02 |
Through Package Via Structures In Panel-based Silicon Substrates And Methods Of Making The Same
App 20120261805 - SUNDARAM; VENKATESH V. ; et al. | 2012-10-18 |
Interconnect Assemblies And Methods Of Making And Using Same
App 20120104603 - Kumbhat; Nitesh ; et al. | 2012-05-03 |
Ultra-thin Interposer Assemblies With Through Vias
App 20120106117 - Sundaram; Venkatesh V. ; et al. | 2012-05-03 |
Lead-free bonding systems
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High-aspect-ratio metal-polymer composite structures for nano interconnects
Grant 7,557,448 - Aggarwal , et al. July 7, 2 | 2009-07-07 |
High-aspect-ratio Metal-polymer Composite Structures For Nano Interconnects
App 20080136035 - Aggarwal; Ankur ; et al. | 2008-06-12 |
High-aspect-ratio metal-polymer composite structures for nano interconnects
Grant 7,262,075 - Aggarwal , et al. August 28, 2 | 2007-08-28 |
Lead-free bonding systems
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High-aspect-ratio metal-polymer composite structures for nano interconnects
App 20050191842 - Aggarwal, Ankur ; et al. | 2005-09-01 |
Method for manufacturing a multilayer wiring substrate
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Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering
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Material and process set for fabrication of molecular matrix print head
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Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
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Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
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Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors
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Seal glass for nozzle assemblies of an ink jet printer
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Multilayered glass-ceramic substrate for mounting of semiconductor device
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Dielectric Glass Overlays And Method For Producing Said Glass Compositions
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Sealing Technique For Gas Panel
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Method Of Sealing Electrodes To Glass With A Glass Frit
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