Patent | Date |
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Stacked chip package structure with leadframe having inner leads with transfer pad Grant 8,207,603 - Shen , et al. June 26, 2 | 2012-06-26 |
Stacked chip package structure with leadframe having bus bar Grant 8,169,061 - Shen , et al. May 1, 2 | 2012-05-01 |
IC package reducing wiring layers on substrate and its carrier Grant 8,026,615 - Lin , et al. September 27, 2 | 2011-09-27 |
Stacked Chip Package Structure with Leadframe Having Inner Leads with Transfer Pad App 20100314729 - SHEN; Geng-Shin ;   et al. | 2010-12-16 |
Chip package having asymmetric molding Grant 7,834,432 - Tu , et al. November 16, 2 | 2010-11-16 |
Stacked Chip Package Structure with Leadframe Having Bus Bar App 20100264527 - SHEN; Geng-Shin ;   et al. | 2010-10-21 |
Stacked Chip Package Structure with Leadframe Having Bus Bar App 20100264530 - SHEN; Geng-Shin ;   et al. | 2010-10-21 |
IC Package Reducing Wiring Layers on Substrate and Its Carrier App 20100264540 - Lin; Hung Tsun ;   et al. | 2010-10-21 |
Stacked chip package structure with leadframe having inner leads with transfer pad Grant 7,816,771 - Shen , et al. October 19, 2 | 2010-10-19 |
Stacked chip package structure with leadframe having bus bar Grant 7,786,595 - Shen , et al. August 31, 2 | 2010-08-31 |
IC package reducing wiring layers on substrate and its chip carrier Grant 7,781,898 - Lin , et al. August 24, 2 | 2010-08-24 |
Chip-Stacked Package Structure with Leadframe Having Multi-Piece Bus Bar App 20100006997 - SHEN; Geng-Shin ;   et al. | 2010-01-14 |
Chip-stacked package structure having leadframe with multi-piece bus bar Grant 7,615,853 - Shen , et al. November 10, 2 | 2009-11-10 |
Chip Package Having Asymmetric Molding App 20090243056 - Tu; Wu-Chang ;   et al. | 2009-10-01 |
Chip package having with asymmetric molding and turbulent plate downset design Grant 7,576,416 - Tu , et al. August 18, 2 | 2009-08-18 |
High frequency IC package and method for fabricating the same Grant 7,554,197 - Huang , et al. June 30, 2 | 2009-06-30 |
Chip package reducing wiring layers on substrate and its carrier App 20080174031 - Lin; Hung-Tsun ;   et al. | 2008-07-24 |
Stacked chip package structure with leadframe having inner leads with transfer pad App 20080099896 - Shen; Geng-Shin ;   et al. | 2008-05-01 |
Stacked chip package structure with leadframe having bus bar App 20080061421 - Shen; Geng-Shin ;   et al. | 2008-03-13 |
Chip-stacked package structure with leadframe having multi-piece bus bar App 20080061412 - Shen; Geng-Shin ;   et al. | 2008-03-13 |
Chip-stacked package structure for lead frame having bus bars with transfer pads App 20080061411 - Shen; Geng-Shin ;   et al. | 2008-03-13 |
High frequency IC package and method for fabricating the same App 20070235871 - Huang; Hsiang-Ming ;   et al. | 2007-10-11 |
Universal Chip Package Structure App 20070228581 - Chou; Shih-Wen ;   et al. | 2007-10-04 |
Chip package having asymmetric molding App 20070085176 - Tu; Wu-Chang ;   et al. | 2007-04-19 |
Universal chip package structure App 20070080466 - Chou; Shih-Wen ;   et al. | 2007-04-12 |