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Patent applications and USPTO patent grants for Tu; Wayne.The latest application filed is for "method and apparatus for electroplating small workpieces".
Patent | Date |
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Method and apparatus for electroplating small workpieces Grant 7,344,630 - Tu , et al. March 18, 2 | 2008-03-18 |
Method and apparatus for electroplating small workpieces App 20070240994 - Tu; Hsiue-Te ;   et al. | 2007-10-18 |
Method and apparatus for nitride spacer etch process implementing in situ interferometry endpoint detection and non-interferometry endpoint monitoring App 20060040415 - Chou; Wen-Ben ;   et al. | 2006-02-23 |
Method and apparatus for nitride spacer etch process implementing in situ interferometry endpoint detection and non-interferometry endpoint monitoring Grant 6,977,184 - Chou , et al. December 20, 2 | 2005-12-20 |
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