Tu; Tsun Chung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tu; Tsun Chung.The latest application filed is for "techniques for mram mtj top electrode connection".
- Tu; Tsun Chung - Tainan City TW
- Tu; Tsun Chung - Tainan TW
- TU; TSUN CHUNG - HSINCHU TW
| Patent | Date |
|---|---|
| Techniques For Mram Mtj Top Electrode Connection App 20220246843 - Chuang; Harry-Hak-Lay ; et al. | 2022-08-04 |
| Techniques For Mram Mtj Top Electrode Connection App 20210351345 - Chuang; Harry-Hak-Lay ; et al. | 2021-11-11 |
| Techniques for MRAM MTJ top electrode connection Grant 11,075,335 - Chuang , et al. July 27, 2 | 2021-07-27 |
| Memory Cell With Top Electrode Via App 20210028350 - Ku; Ming-Che ; et al. | 2021-01-28 |
| Memory Cell With Top Electrode Via App 20200403146 - Ku; Ming-Che ; et al. | 2020-12-24 |
| Memory cell with top electrode via Grant 10,790,439 - Ku , et al. September 29, 2 | 2020-09-29 |
| Techniques For Mram Mtj Top Electrode Connection App 20200098982 - Chuang; Harry-Hak-Lay ; et al. | 2020-03-26 |
| Memory Cell With Top Electrode Via App 20200035908 - Ku; Ming-Che ; et al. | 2020-01-30 |
| Method for manufacturing mixed-dimension and void-free MRAM structure Grant 10,109,790 - Chuang , et al. October 23, 2 | 2018-10-23 |
| Method For Manufacturing Semiconductor Structure App 20170352804 - CHUANG; HARRY-HAK-LAY ; et al. | 2017-12-07 |
| Method For Manufacturing Mixed-dimension And Void-free Mram Structure App 20170301856 - CHUANG; HARRY-HAK-LAY ; et al. | 2017-10-19 |
| Method for manufacturing mixed-dimension and void-free MRAM structure Grant 9,780,301 - Chuang , et al. October 3, 2 | 2017-10-03 |
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