loadpatents
name:-0.01387095451355
name:-0.01128101348877
name:-0.0048351287841797
Tu; Shang-Yun Patent Filings

Tu; Shang-Yun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tu; Shang-Yun.The latest application filed is for "display device and manufacturing method thereof".

Company Profile
4.11.12
  • Tu; Shang-Yun - Hsinchu City TW
  • Tu; Shang-Yun - Hsinchu TW
  • Tu; Shang-Yun - Hsin-Chu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Display Device And Manufacturing Method Thereof
App 20220149141 - Wu; Sheng-Yu ;   et al.
2022-05-12
Display device and manufacturing method thereof
Grant 11,239,305 - Wu , et al. February 1, 2
2022-02-01
Conductive structures and redistribution circuit structures
Grant 11,152,273 - Tu , et al. October 19, 2
2021-10-19
Display Device And Manufacturing Method Thereof
App 20210028266 - Wu; Sheng-Yu ;   et al.
2021-01-28
Conductive Structures And Redistribution Circuit Structures
App 20200243410 - Tu; Shang-Yun ;   et al.
2020-07-30
Redistribution circuit structures and methods of forming the same
Grant 10,629,509 - Tu , et al.
2020-04-21
Redistribution Circuit Structures And Methods Of Forming The Same
App 20190131200 - Tu; Shang-Yun ;   et al.
2019-05-02
Method for manufacturing semiconductor package structure
Grant 10,037,973 - Tseng , et al. July 31, 2
2018-07-31
Connector structures of integrated circuits
Grant 9,991,218 - Tu , et al. June 5, 2
2018-06-05
Method of Manufacturing Connector Structures of Integrated Circuits
App 20170229413 - Tu; Shang-Yun ;   et al.
2017-08-10
Method of manufacturing connector structures of integrated circuits
Grant 9,659,903 - Tu , et al. May 23, 2
2017-05-23
Method For Manufacturing Semiconductor Package Structure
App 20160336298 - TSENG; HUA-WEI ;   et al.
2016-11-17
Connector Structures of Integrated Circuits
App 20160268227 - Tu; Shang-Yun ;   et al.
2016-09-15
Semiconductor package structure and manufacturing method thereof
Grant 9,406,629 - Tseng , et al. August 2, 2
2016-08-02
Connector structures of integrated circuits
Grant 9,373,598 - Tu , et al. June 21, 2
2016-06-21
Semiconductor Package Structure And Manufacturing Method Thereof
App 20160111384 - TSENG; HUA-WEI ;   et al.
2016-04-21
Connector Structures of Integrated Circuits
App 20150303160 - Tu; Shang-Yun ;   et al.
2015-10-22
Connector structures of integrated circuits
Grant 9,093,440 - Tu , et al. July 28, 2
2015-07-28
Connector Structures of Integrated Circuits
App 20140231987 - Tu; Shang-Yun ;   et al.
2014-08-21
Connector structures of integrated circuits
Grant 8,729,699 - Tu , et al. May 20, 2
2014-05-20
Connector Structures of Integrated Circuits
App 20130093079 - Tu; Shang-Yun ;   et al.
2013-04-18

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