Tu; Ping Liang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tu; Ping Liang.The latest application filed is for "direct die attach utilizing heated bond head".
- Tu; Ping Liang - Hong Kong CN
- Tu; Ping Liang - Kwai Chung HK
| Patent | Date |
|---|---|
| Method of bonding semiconductor devices utilizing solder balls Grant 8,012,866 - Tu , et al. September 6, 2 | 2011-09-06 |
| Direct die attach utilizing heated bond head Grant 7,854,365 - Li , et al. December 21, 2 | 2010-12-21 |
| Direct Die Attach Utilizing Heated Bond Head App 20100105172 - LI; Ming ; et al. | 2010-04-29 |
| Manufacturing process and apparatus therefor utilizing reducing gas Grant 7,648,901 - Tu , et al. January 19, 2 | 2010-01-19 |
| Method Of Bonding Semiconductor Devices Utilizing Solder Balls App 20090298278 - TU; Ping Liang ; et al. | 2009-12-03 |
| Manufacturing Process And Apparatus Therefor Utilizing Reducing Gas App 20080078145 - TU; Ping Liang ; et al. | 2008-04-03 |
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