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Patent applications and USPTO patent grants for Tu; Nghia Thuc.The latest application filed is for "foil based semiconductor package".
Patent | Date |
---|---|
Thin foil semiconductor package Grant 8,857,047 - Bayan , et al. October 14, 2 | 2014-10-14 |
Foil plating for semiconductor packaging Grant 8,377,267 - Bayan , et al. February 19, 2 | 2013-02-19 |
Method of making foil based semiconductor package Grant 8,375,577 - Wong , et al. February 19, 2 | 2013-02-19 |
Thin foil semiconductor package Grant 8,341,828 - Bayan , et al. January 1, 2 | 2013-01-01 |
Microarray package with plated contact pedestals Grant 8,293,573 - Bayan , et al. October 23, 2 | 2012-10-23 |
Foil based semiconductor package Grant 8,101,470 - Poddar , et al. January 24, 2 | 2012-01-24 |
Foil Based Semiconductor Package App 20110074003 - PODDAR; Anindya ;   et al. | 2011-03-31 |
Foil Plating For Semiconductor Packaging App 20110073481 - BAYAN; Jaime A. ;   et al. | 2011-03-31 |
Microarray package with plated contact pedestals Grant 7,893,523 - Bayan , et al. February 22, 2 | 2011-02-22 |
Thin Foil Semiconductor Package App 20110023293 - BAYAN; Jaime A. ;   et al. | 2011-02-03 |
Die attach method and leadframe structure Grant 7,859,090 - Bayan , et al. December 28, 2 | 2010-12-28 |
Universal lead frame for micro-array packages Grant 7,846,775 - Lee , et al. December 7, 2 | 2010-12-07 |
Thin foil semiconductor package Grant 7,836,586 - Bayan , et al. November 23, 2 | 2010-11-23 |
Thin Foil For Use In Packaging Integrated Circuits App 20100084748 - PODDAR; Anindya ;   et al. | 2010-04-08 |
Thin Foil Semiconductor Package App 20100046188 - BAYAN; Jaime A. ;   et al. | 2010-02-25 |
Die Attach Method And Leadframe Structure App 20090315161 - BAYAN; Jaime A. ;   et al. | 2009-12-24 |
Foil Based Semiconductor Package App 20090305076 - Wong; Will ;   et al. | 2009-12-10 |
Die attach method and microarray leadframe structure Grant 7,598,122 - Bayan , et al. October 6, 2 | 2009-10-06 |
Apparatus and method for miniature semiconductor packages Grant 7,419,855 - Lee , et al. September 2, 2 | 2008-09-02 |
Apparatus and method for miniature semiconductor packages Grant 7,161,232 - Lee , et al. January 9, 2 | 2007-01-09 |
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