loadpatents
name:-0.11320018768311
name:-0.024127960205078
name:-0.00089693069458008
Tu; Nghia Thuc Patent Filings

Tu; Nghia Thuc

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tu; Nghia Thuc.The latest application filed is for "foil based semiconductor package".

Company Profile
0.15.7
  • Tu; Nghia Thuc - San Jose CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Thin foil semiconductor package
Grant 8,857,047 - Bayan , et al. October 14, 2
2014-10-14
Foil plating for semiconductor packaging
Grant 8,377,267 - Bayan , et al. February 19, 2
2013-02-19
Method of making foil based semiconductor package
Grant 8,375,577 - Wong , et al. February 19, 2
2013-02-19
Thin foil semiconductor package
Grant 8,341,828 - Bayan , et al. January 1, 2
2013-01-01
Microarray package with plated contact pedestals
Grant 8,293,573 - Bayan , et al. October 23, 2
2012-10-23
Foil based semiconductor package
Grant 8,101,470 - Poddar , et al. January 24, 2
2012-01-24
Foil Based Semiconductor Package
App 20110074003 - PODDAR; Anindya ;   et al.
2011-03-31
Foil Plating For Semiconductor Packaging
App 20110073481 - BAYAN; Jaime A. ;   et al.
2011-03-31
Microarray package with plated contact pedestals
Grant 7,893,523 - Bayan , et al. February 22, 2
2011-02-22
Thin Foil Semiconductor Package
App 20110023293 - BAYAN; Jaime A. ;   et al.
2011-02-03
Die attach method and leadframe structure
Grant 7,859,090 - Bayan , et al. December 28, 2
2010-12-28
Universal lead frame for micro-array packages
Grant 7,846,775 - Lee , et al. December 7, 2
2010-12-07
Thin foil semiconductor package
Grant 7,836,586 - Bayan , et al. November 23, 2
2010-11-23
Thin Foil For Use In Packaging Integrated Circuits
App 20100084748 - PODDAR; Anindya ;   et al.
2010-04-08
Thin Foil Semiconductor Package
App 20100046188 - BAYAN; Jaime A. ;   et al.
2010-02-25
Die Attach Method And Leadframe Structure
App 20090315161 - BAYAN; Jaime A. ;   et al.
2009-12-24
Foil Based Semiconductor Package
App 20090305076 - Wong; Will ;   et al.
2009-12-10
Die attach method and microarray leadframe structure
Grant 7,598,122 - Bayan , et al. October 6, 2
2009-10-06
Apparatus and method for miniature semiconductor packages
Grant 7,419,855 - Lee , et al. September 2, 2
2008-09-02
Apparatus and method for miniature semiconductor packages
Grant 7,161,232 - Lee , et al. January 9, 2
2007-01-09

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