Tu; Nghia T.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tu; Nghia T..The latest application filed is for "backmetal replacement for use in the packaging of integrated circuits".
- Tu; Nghia T. - San Jose CA US
| Patent | Date |
|---|---|
| Foil-based method for packaging intergrated circuits Grant 8,389,334 - Poddar , et al. March 5, 2 | 2013-03-05 |
| Method and leadframe for packaging integrated circuits Grant 8,298,871 - Wong , et al. October 30, 2 | 2012-10-30 |
| Backmetal Replacement For Use In The Packaging Of Integrated Circuits App 20120074561 - TU; Nghia T. ; et al. | 2012-03-29 |
| Thin Foil Semiconductor Package App 20120043660 - Poddar; Anindya ; et al. | 2012-02-23 |
| Laser Ablation Alternative To Low Cost Leadframe Process App 20110269269 - TU; Nghia T. ; et al. | 2011-11-03 |
| Method And Leadframe For Packaging Integrated Circuits App 20110104854 - Wong; Will K. ; et al. | 2011-05-05 |
| Microarray Package With Plated Contact Pedestals App 20100136749 - BAYAN; Jaime ; et al. | 2010-06-03 |
| Microarray Package With Plated Contact Pedestals App 20100117206 - BAYAN; Jaime ; et al. | 2010-05-13 |
| Microarray package with plated contact pedestals Grant 7,671,452 - Bayan , et al. March 2, 2 | 2010-03-02 |
| Method And Leadframe For Packaging Integrated Circuits App 20090160039 - WONG; Will K. ; et al. | 2009-06-25 |
| Apparatus and method for dicing semiconductor wafers Grant 6,933,212 - Lee , et al. August 23, 2 | 2005-08-23 |
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