TU; Ming-Te
Patent Applications and Registrations
Patent applications and USPTO patent grants for TU; Ming-Te.The latest application filed is for "chip packaging method".
Company Profile
6.30.46
- TU; Ming-Te - TAICHUNG CITY TW
- Tu; Ming-Te - Taichung TW
- Tu; Ming-Te - Taichung County TW
- Tu; Ming-Te - Taipei Hsien TW
- Tu; Ming-Te - Taipei TW
- Tu; Ming Te - Ping Chen TW
- Tu, Ming Te - Ping Chen City TW
Patent Activity
| Patent | Date |
|---|---|
| Chip Packaging Method App 20220148887 - TU; Ming-Te | 2022-05-12 |
| Pressure sensor package Grant 11,041,774 - Tu , et al. June 22, 2 | 2021-06-22 |
| Waterproof MEMS chip package structure Grant 10,696,543 - Tien , et al. June 30, 2 | 2020-06-30 |
| Microelectromechanical Microphone Package Structure App 20200109044 - YU; Chao-Wei ; et al. | 2020-04-09 |
| Chip Package Structure Having Function Of Preventing Adhesive From Overflowing App 20200105636 - CHEN; Wei-Jen ; et al. | 2020-04-02 |
| Pressure Sensor Package App 20190265118 - TU; Ming-Te ; et al. | 2019-08-29 |
| Package structure of long-distance sensor and packaging method of the same Grant 10,396,234 - Lin , et al. A | 2019-08-27 |
| MEMS microphone package Grant 10,362,377 - Liao , et al. | 2019-07-23 |
| MEMS microphone package Grant 10,362,406 - Yeh , et al. | 2019-07-23 |
| Substrate And Package Module Including The Same App 20190198406 - CHEN; Yu-Shiang ; et al. | 2019-06-27 |
| Substrate and package module including the same Grant 10,312,169 - Chen , et al. | 2019-06-04 |
| MEMS microphone package Grant 10,299,046 - Liao , et al. | 2019-05-21 |
| Packaging method of long-distance sensor Grant 10,103,286 - Lin , et al. October 16, 2 | 2018-10-16 |
| Package structure of long-distance sensor and packaging method of the same Grant 10,090,427 - Lin , et al. October 2, 2 | 2018-10-02 |
| Package Structure Of Long-distance Sensor And Packaging Method Of The Same App 20180190856 - LIN; Ching-I ; et al. | 2018-07-05 |
| Package Structure Of Optical Module App 20180190630 - TU; Ming-Te ; et al. | 2018-07-05 |
| Package Structure Of Long-distance Sensor And Packaging Method Of The Same App 20180190858 - Lin; Ching-I ; et al. | 2018-07-05 |
| Packaging Method Of Long-distance Sensor App 20180190857 - LIN; Ching-I ; et al. | 2018-07-05 |
| Microphone package structure Grant 10,003,874 - Yeh , et al. June 19, 2 | 2018-06-19 |
| Optical sensing module and method of manufacturing the same Grant 9,952,089 - Tu , et al. April 24, 2 | 2018-04-24 |
| Microphone Package Structure App 20180063614 - YEH; Yao-Ting ; et al. | 2018-03-01 |
| Mems Microphone Package App 20180063645 - YEH; Yao-Ting ; et al. | 2018-03-01 |
| Mems Microphone Package App 20180063646 - LIAO; Hsien-Ken ; et al. | 2018-03-01 |
| Mems Microphone Package App 20180063615 - LIAO; Hsien-Ken ; et al. | 2018-03-01 |
| Microelectromechanical Microphone Package Structure App 20180063616 - LIAO; Hsien-Ken ; et al. | 2018-03-01 |
| Optical module integrated package Grant 9,905,548 - Tu , et al. February 27, 2 | 2018-02-27 |
| Package structure of an optical module Grant 9,705,025 - Tu , et al. July 11, 2 | 2017-07-11 |
| Package structure of optical module having printed shielding layer and its method for packaging Grant 9,647,178 - Tu , et al. May 9, 2 | 2017-05-09 |
| Pressure sensor package Grant 9,618,415 - Tu , et al. April 11, 2 | 2017-04-11 |
| Optical Module Integrated Package App 20160365339 - TU; Ming-Te ; et al. | 2016-12-15 |
| Optical module package and its packaging method Grant 9,478,693 - Tu , et al. October 25, 2 | 2016-10-25 |
| Optical module integrated package Grant 9,449,955 - Tu , et al. September 20, 2 | 2016-09-20 |
| LED lamp strip and manufacturing process thereof Grant 9,416,930 - Tu , et al. August 16, 2 | 2016-08-16 |
| Flip-chip Mems Microphone App 20160157024 - LIAO; Hsien-Ken ; et al. | 2016-06-02 |
| Optical Module Package And Its Packaging Method App 20160126403 - TU; Ming-Te ; et al. | 2016-05-05 |
| Pressure Sensor Package App 20160116359 - TU; Ming-Te ; et al. | 2016-04-28 |
| Micro optical package structure with filtration layer and method for making the same Grant 9,312,402 - Tu , et al. April 12, 2 | 2016-04-12 |
| MEMS microphone packaging method Grant 9,309,108 - Liao , et al. April 12, 2 | 2016-04-12 |
| Quad-flat Non-lead Package Structure And Method Of Packaging The Same App 20160093556 - TU; Ming-Te ; et al. | 2016-03-31 |
| Optical Sensing Module And Method Of Manufacturing The Same App 20160091364 - TU; Ming-Te ; et al. | 2016-03-31 |
| Mems Microphone Packaging Method App 20160052779 - LIAO; Hsien-Ken ; et al. | 2016-02-25 |
| Stacked Mems Microphone Packaging Method App 20160052780 - LIAO; Hsien-Ken ; et al. | 2016-02-25 |
| Stacked MEMS microphone packaging method Grant 9,260,298 - Liao , et al. February 16, 2 | 2016-02-16 |
| Method for packaging an optical module Grant 9,190,398 - Tu , et al. November 17, 2 | 2015-11-17 |
| Optical Module With Optical Concentration Structure And Packaging Method Thereof App 20150279826 - TU; Ming-Te ; et al. | 2015-10-01 |
| Optical Module Integrated Package App 20150279827 - TU; Ming-Te ; et al. | 2015-10-01 |
| Quad-flat No-leads Package Structure And Method Of Manufacturing The Same App 20150279796 - TU; Ming-Te ; et al. | 2015-10-01 |
| Micro Optical Package Structure With Filtration Layer And Method For Making The Same App 20150187963 - TU; Ming-Te ; et al. | 2015-07-02 |
| Package Structure Of Optical Module App 20150111324 - TU; Ming-Te ; et al. | 2015-04-23 |
| Package Structure Of Optical Module App 20150091024 - TU; Ming-Te ; et al. | 2015-04-02 |
| Package Structure Of An Optical Module App 20150028358 - TU; Ming-Te ; et al. | 2015-01-29 |
| Package Structure Of Optical Module App 20150028360 - TU; Ming-Te ; et al. | 2015-01-29 |
| Package Structure Of Optical Module App 20150028378 - TU; Ming-Te ; et al. | 2015-01-29 |
| Package Structure Of An Optical Module App 20150028357 - TU; Ming-Te ; et al. | 2015-01-29 |
| Package Structure Of Optical Module App 20150028371 - TU; Ming-Te ; et al. | 2015-01-29 |
| Package Structure Of An Optical Module App 20150028359 - TU; Ming-Te ; et al. | 2015-01-29 |
| Led Lamp Strip And Manufacturing Process Thereof App 20140126209 - TU; Ming-Te ; et al. | 2014-05-08 |
| LED lamp strip and manufacturing process thereof Grant 8,664,045 - Tu , et al. March 4, 2 | 2014-03-04 |
| Optical module package unit Grant 8,362,496 - Tu , et al. January 29, 2 | 2013-01-29 |
| Led Lamp Strip And Manufacturing Process Thereof App 20120228645 - TU; Ming-Te ; et al. | 2012-09-13 |
| Cap package for micro electro-mechanical system Grant 7,511,373 - Tien , et al. March 31, 2 | 2009-03-31 |
| Chip Package Capable Of Minimizing Electro-magnetic Interference App 20080164583 - Tien; Jiung-Yue ; et al. | 2008-07-10 |
| Cap Package For Micro Electro-mechanical System Capable Of Minimizing Electro-magnetic Interference App 20080164602 - TIEN; Jiung-Yue ; et al. | 2008-07-10 |
| Cap Package For Micro Electro-mechanical System App 20080164594 - TIEN; Jiung-Yue ; et al. | 2008-07-10 |
| Micro Electro-mechanical System Module Package Capable Of Minimizing Interference Of Noises App 20080079141 - Tien; Jiung-Yue ; et al. | 2008-04-03 |
| Conductor-driving multi-hole micro sprinkle-nozzle and sprinkling cap made therewith App 20080023570 - Tu; Ming-Te ; et al. | 2008-01-31 |
| Automatic liquid dispensing mechanism App 20060292021 - Tu; Ming-Te | 2006-12-28 |
| Headgear capable of sprinkling and cooling Grant 7,127,907 - Tu October 31, 2 | 2006-10-31 |
| Headgear capable of sprinkling and cooling App 20060112707 - Tu; Ming-Te | 2006-06-01 |
| Liquid extruding device App 20060011656 - Tu; Ming-Te | 2006-01-19 |
| Liquid rationing device Grant 6,948,638 - Tu September 27, 2 | 2005-09-27 |
| Liquid rationing device App 20050127104 - Tu, Ming Te | 2005-06-16 |
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